Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
TRI Launches High Performance 3D SPI Solution
August 14, 2023 | TRIEstimated reading time: Less than a minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the TR7007Q SII, a state-of-the-art 3D SPI system designed to maximize production efficiency.
With its high-speed platform, the TR7007Q SII delivers up to 50% faster inspection compared to previous models, ensuring manufacturers achieve unparalleled performance. The TR7007Q SII is equipped with a 9.8 ?m high-resolution 21 MP Camera, delivering enhanced measurement accuracy and stability, ideal for diverse industries. The 3D SPI's versatility ensures reliable and precise results. The TR7007Q SII can also effectively inspect Bumps, Flux, Mini LED Solder, and Bare Boards.
- Solder Bridge
- Bump
- Flux
- Mini LED Solder
- Solder Measurement
The 3D SPI's improved accuracy and stability enable precise solder measurements and minimize false calls, guaranteeing reliable inspection results. Equipped with a wide spectrum light system and coaxial lighting, the TR7007Q SII provides higher contrast, exceptional clarity, and uniformity significantly improving the detection rates.
The Smart 3D SPI solutions ease data exchange between the production line and the MES of your choice to enable data traceability for the connected factory. TRI's SPI platforms facilitate data exchange for closed-loop and support the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.