Nolan’s Notes: Everyone Has Their Eye on India
Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
SummerCom 2023
August 14, 2023 | Teresa Rowe, IPC Senior Director, Assembly and Standards TechnologyEstimated reading time: 1 minute
Energized. Engaged. Exhausted.
These are just a few of the words that come to mind when looking back on IPC SummerCom 2023 in May. We did a lot of work, had a little fun, and recognized the hard work and hours that go into standards development.
With seven days of standards development meetings—co-located with the Electrical Wire Processing Technology Expo (EWPTE), a trade show for the electrical wire harness, wire and cable processing industries—there is, once again, confirmation that even with the ease of teleconferencing, bringing technical experts together in person is an opportunity for groups to immerse themselves in development with minimal distractions.
Getting the Job Done
More than 90 task groups, A-Teams, training committees, and special project teams met during SummerCom in Milwaukee, Wisconsin. Discussions covered a broad range of topics that included reviewing cutting-edge technologies, resolving comments submitted by industry, and discussing current and future projects. Both long-time committee members and attendees new to standards development brought different perspectives and ideas to the table. This is important because technology changes, tribal knowledge can be lost, and it’s important to hear both sides when making decisions.
To read this entire article, which appeared in the summer issue of IPC’s Community Magazine, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.