The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
IPC Day Romania: Build Electronics Better with Standards and Solutions, Conference Powered by FLEX
August 14, 2023 | IPCEstimated reading time: Less than a minute
IPC Day Romania: Build Electronics Better with Standards and Solutions, Conference Powered by Flex, will provide a unique opportunity to learn about the latest advancements in electronics manufacturing, participate in industry discussions, and network with a community of professionals dedicated to building electronics better. The conference will be held on September 27-28, 2023.
Presentation and panel discussions will feature industry experts in electronics reliability, e-mobility, medical meets 5G, education and training, and IPC leadership. The world-class lineup includes speakers and panelists from NASA, Stellantis, Bosch, FLEX, Indium, TTM Technologies, Viscom, Nokia, IPC, The Polytechnic University, and Vitesco. Complete agenda coming soon!
Topics include:
- Electronics Reliability
- Introduction to solder joint reliability standards & simulations,
- electronics reliability in space applications.
- E-mobility Reliability Panel
- Medical meets 5G
- Education and Training – University studies and IPC certification and training programs
- IPC opportunities to participate in standards development, educational opportunities, and events
Who should attend?
- Manufacturing, quality, and design engineers
- Members of academia
- Senior and junior engineering students
- Specialist or practitioner in manufacturing
Location: Auditorium of the Library of the Polytechnical University in Timisoara, Romania
Share on:
Suggested Items
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/15/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.
KYZEN to Highlight Understencil and PCB Cleaners at SMTA Querétaro Expo and Tech Forum
07/09/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, July 24, at Centro de Congresos y Teatro Metropolitano de Querétaro.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.