-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
European Collaborative APPLAUSE Project Successfully Completed
August 16, 2023 |Estimated reading time: 3 minutes
Würth Elektronik Circuit Board Technology was one of 31 European partners involved in carrying out the project “Advanced packaging for photonics, optics, and electronics for low-cost manufacturing in Europe” – APPLAUSE for short. The overall aim of the project was to strengthen the semiconductor value chain for the medical sector in Europe by developing new tools, methods, and processes for volume production. The project partners consisted of competence leaders from the fields of electronics packaging, optics, and photonics, together with leading equipment manufacturers and medical technology experts. The three-year project, with a total budget of EUR 34 million, was funded by ECSEL JU (Electronics Components and Systems for European Leadership Joint Undertaking) as part of the Horizon 2020 EU funding program. APPLAUSE was an innovation project of the European Commission in the field of electronics research.
Würth Elektronik Circuit Board Technology participated in the following three use cases:
Low-cost thermal imaging systems
A hybrid panel-level packaging process was developed for use in a thermal imaging camera here. Printed circuit boards formed the basis for the assembly and connection technology of the system-in-package (SiP). The main areas of development were printed circuit board technology, wire bonding and encapsulation of large optical chips.
Minimally invasive cardiac implants
A catheter was equipped with accelerometers to measure contractions of the heart in this context. Würth Elektronik Circuit Board Technology was involved in the design of the circuit boards and production of the substrates. To this end, novel ultra-flexible and rigid-flexible stackups were designed with the project partner OSYPKA AG, and the printed circuit boards were manufactured on the basis of skin-friendly substrates.
Cardiac monitoring systems
Würth Elektronik Circuit Board Technology participated in the development of an intelligent patch (smart patch) for cardiac monitoring. Two systems – a mini-patch (three electrodes, short-term monitoring) and a maxi-patch (six electrodes, longer, steady-state monitoring) were set up. Würth Elektronik Circuit Board Technology focused on designing the layout of the stretchable substrates and manufacturing them. A completely new approach to integration was developed in this work. It was based on a stretchable printed circuit board made of thermoplastic polyurethane (TPU). It was possible to make this using standard PCB production techniques, which brought many of the advantages of conventional PCB technology, such as assembly of components using pick-and-place machines. This advantage was exploited by integrating the electrical functions into a dual system-in-package (SiP) design that could be mounted directly on the flexible/stretchable PCB. Printing the electrodes directly on the flexible printed circuit board and integrating all the electronics into a textile substrate represent crucial advances in the development of medical patches for monitoring bodily functions. The high degree of miniaturization and tight integration resulted in a very unobtrusive form factor, while the stretchable PCB provided a very pliable, biocompatible substrate. In addition to Würth Elektronik Circuit Board Technology, other partners, including Fraunhofer IZM, Fraunhofer ENAS, Interuniversitair Micro-Electronica Centrum (IMEC) and Precordior OY played an important part in the implementation of this use case.
“Through the work on the APPLAUSE project, we have taken significant steps forward in the development of complete medical systems and, in particular, close-to-body applications. This is down to the synergies and excellent collaboration between the partners within the consortium. Discussions are currently being held with some of the project partners on finalizing the development after the project has been completed with the clear aim of moving on to industrial production,” is the conclusion of Dr. Alina Schreivogel, Head of the Research Center at Würth Elektronik Circuit Board Technology.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Ecolab to Acquire Ovivo’s Electronics Ultra-Pure Water Business
08/15/2025 | EcolabEcolab Inc. has entered into a definitive agreement to acquire Ovivo’s Electronics business, a leading and fast-growing global provider of breakthrough ultra-pure water technologies for semiconductor manufacturing.
BTU International to Feature Aurora Reflow Technology at SMTA Michigan and Ohio Expos
08/15/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the upcoming SMTA Michigan Expo & Tech Forum on Tuesday, August 19 in Livonia, MI, and the SMTA Ohio Expo & Tech Forum on Thursday, August 21 in Independence, OH.
Kimball Electronics Reports Q4 Results With Solid Finish to the Fiscal Year
08/15/2025 | BUSINESS WIREKimball Electronics, Inc. announced financial results for the fourth quarter and fiscal year ended June 30, 2025.
Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe
08/15/2025 | PR NewswirePolymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.
Foxconn Announces Q2 2025 Financial Results
08/15/2025 | FoxconnSecond quarter revenue reached NT$1.79 trillion, with both operating profit and net profit setting record highs for the second-quarter period; earnings per share was NT$3.19 in the April-June period.