Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
The Marketing Minute: Strategic Short-form Content Builds Brand Momentum
SMT Perspectives and Prospects: Artificial Intelligence, Part 5: Brain, Mind, Intelligence
Arrow Electronics Names Rick Marano President of Global Components
August 17, 2023 | Business WireEstimated reading time: Less than a minute
Arrow Electronics, Inc. announced that Rick Marano will be named president of the company’s global components business, subject to formal Board appointment at the Board’s next regularly scheduled meeting on Sept. 13, 2023.
Rick Marano will succeed Kirk Schell and will report to Sean J. Kerins, president and chief executive officer.
Previously Mr. Marano served as president of Arrow’s Americas components business and has been with the company for over 30 years, starting in sales and steadily growing his career through the leadership ranks.
“Rick is a widely respected leader and mentor, with a particular track record of consistently developing talent and driving business results,” said Mr. Kerins. “We look to Rick to build upon the growth of our components business.”
Share on:
Suggested Items
IPC Welcomes Exemptions to Reciprocal Tariffs
04/14/2025 | IPCIPC shared the following statement today on tariff exclusions and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO:
ASMPT Demonstrates Technology Leadership in SMT Assembly
04/09/2025 | ASMPTThe rapid development of artificial intelligence is driving the demand for high-performance processors and placing great demands on electronics manufacturing.
Tariff Uncertainty Weighs on Display Demand, Pricing, and the Supply of AMOLED Materials,
04/09/2025 | TrendForceTrendForce reports that the U.S. began implementing reciprocal tariffs on April 9th, based largely on trade deficits. Consequently, Asia—particularly Southeast Asia, a key hub for the consumer electronics supply chain—has been significantly impacted.
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
New Cryostatic Systems Elevate Current Research on Qubits
03/31/2025 | Fraunhofer IAFThe Center Nanoelectronic Technologies (CNT) at Fraunhofer IPMS has recently acquired new cryostats for the research on qubits and the qualification of superconducting systems.