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Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
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It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
August 18, 2023 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes

Summer is almost over; it seems like it just started. But I got in some much-needed beach time last week, so I’m happy. Have you taken any vacation time this summer?
The news and innovations in our industry haven’t really slowed down during the summer months, as evidenced by this week’s Top Five. This week, we have an article about flex-hybrid electronics, which the military and aerospace folks are following closely. We have an article about the digital twin and what it is—and what it’s not.
We have 10 outside-the-box ideas for closing the deal—be sure to forward this to your sales team. John Perry brings us an interview with a father/son team of IPC volunteers. (Would you want your children to work in this industry?) Finally, John Watson discusses AI, simulation and SPICE, and what they have to offer for PCB designers.
I’ll talk to you all soon!
Flexible Thinking: Growth of Flex and Flex-hybrid Electronics in Mil-Aero Applications
Published August 15
Technologists working with flexible circuits seem to come up with new, innovative ideas almost weekly. One of the latest is flex-hybrid electronics, which have shown plenty of promise in the mil-aero community. Joe Fjelstad explains what FHE could do for our industry, and the warfighter of the future as well.
Drilling Down on Digital Twin
Published August 16
In this interview, Phil Voglewede, director of the Omron Advanced Automation Lab at Marquette, breaks down the relationship between digital twin and automation. As he points out, it’s not just simulation. Ask not what you can do for digital twin; ask what digital twin can do for you!
It’s Only Common Sense: My 10 Favorite Creative Sales Tactics
Published August 14
It’s tough making a sale these days, and your sales team need every advantage. This week, Dan Beaulieu shares 10 of his favorite sales tactics that are a little off the beaten path, including nostalgia and “gamification.” Check it out.
From Father to Son: A Story of Generational Volunteerism
Published August 16
Would you want your children (or grandchildren) to get into this industry? IPC’s John Perry has a great interview with Scott Bowles and his son Steven, who both work for Lockheed Martin and serve as IPC volunteers. Do they talk about solder mask during Thanksgiving dinner?
Elementary, Mr. Watson: Circuit Simulation, SPICE, and AI
Published August 15
There’s been a lot of talk about AI lately. But what does it mean for our industry? In this column, John Watson explains how PCB designers and design engineers can benefit from utilizing AI, and how circuit simulation and SPICE are somewhat related to AI. Interesting stuff.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.