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Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
August 18, 2023 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
Summer is almost over; it seems like it just started. But I got in some much-needed beach time last week, so I’m happy. Have you taken any vacation time this summer?
The news and innovations in our industry haven’t really slowed down during the summer months, as evidenced by this week’s Top Five. This week, we have an article about flex-hybrid electronics, which the military and aerospace folks are following closely. We have an article about the digital twin and what it is—and what it’s not.
We have 10 outside-the-box ideas for closing the deal—be sure to forward this to your sales team. John Perry brings us an interview with a father/son team of IPC volunteers. (Would you want your children to work in this industry?) Finally, John Watson discusses AI, simulation and SPICE, and what they have to offer for PCB designers.
I’ll talk to you all soon!
Flexible Thinking: Growth of Flex and Flex-hybrid Electronics in Mil-Aero Applications
Published August 15
Technologists working with flexible circuits seem to come up with new, innovative ideas almost weekly. One of the latest is flex-hybrid electronics, which have shown plenty of promise in the mil-aero community. Joe Fjelstad explains what FHE could do for our industry, and the warfighter of the future as well.
Drilling Down on Digital Twin
Published August 16
In this interview, Phil Voglewede, director of the Omron Advanced Automation Lab at Marquette, breaks down the relationship between digital twin and automation. As he points out, it’s not just simulation. Ask not what you can do for digital twin; ask what digital twin can do for you!
It’s Only Common Sense: My 10 Favorite Creative Sales Tactics
Published August 14
It’s tough making a sale these days, and your sales team need every advantage. This week, Dan Beaulieu shares 10 of his favorite sales tactics that are a little off the beaten path, including nostalgia and “gamification.” Check it out.
From Father to Son: A Story of Generational Volunteerism
Published August 16
Would you want your children (or grandchildren) to get into this industry? IPC’s John Perry has a great interview with Scott Bowles and his son Steven, who both work for Lockheed Martin and serve as IPC volunteers. Do they talk about solder mask during Thanksgiving dinner?
Elementary, Mr. Watson: Circuit Simulation, SPICE, and AI
Published August 15
There’s been a lot of talk about AI lately. But what does it mean for our industry? In this column, John Watson explains how PCB designers and design engineers can benefit from utilizing AI, and how circuit simulation and SPICE are somewhat related to AI. Interesting stuff.
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Klaus Koziol - atgSuggested Items
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10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
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Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.