-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Gen3 to Exhibit at the 24th European Microelectronics & Packaging Conference
August 29, 2023 | Gen3Estimated reading time: 1 minute

Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimization equipment, is excited to announce its participation at the 24th European Microelectronics & Packaging Conference (EMPC) taking place Sept. 11-14, 2023 at the Wellcome Genome Campus, Hinxton, near Cambridge, UK.
At the conference, Sascha Lohse, from Finetech, Gen3's principal will be presenting a paper titled 'Fine Pitch Micro Indium Bump Interconnect Flip Chip Bonding.' The presentation will delve into the challenges faced in producing large format, high-density IR thermal imaging FPA devices, Quantum processors, and micro LED displays using fine pitch micro Indium bump array interconnections that meet the rigorous industry requirements of today.
Lohse is an esteemed expert in microsystems technology, having graduated in the field in 2006 from the University of Applied Science in Berlin. He has acquired extensive experience in both frontend and backend processes while working at the Hahn Schickard Gesellschaft and the Fraunhofer IZM. Presently, Sascha leads the product management, application, and technical documentation teams, and he serves on Finetech's executive board. His profound knowledge of multiple bonding technologies has allowed him to tackle various packaging challenges throughout his career.
The EMPC conference provides an ideal platform for Gen3 to showcase its advanced microelectronics solutions to a diverse audience of industry professionals, researchers, and decision-makers. Gen3's cutting-edge technology addresses the industry's evolving needs, enabling customers to achieve exceptional results in their microelectronics projects.
Gen3 looks forward to engaging with conference attendees, networking with industry peers, and demonstrating its commitment to advancing microelectronics technologies.
For further information about Gen3 and their range of reliable test and measurement equipment, please visit www.gen3systems.com.
Additional content from Gen3:
- The Printed Circuit Assembler’s Guide to… Process Control by Graham K. Naisbitt, Dr. Chris Hunt
- The Printed Circuit Assembler’s Guide to… Process Validation by Graham K. Naisbitt
- I-007e Micro Webinar Series: “Predicting Reliability in Electronics”
- Roundtable Discussion: Process Ionic Contamination Test (PCT) Standard Roundtable with Industry Experts
You can view other titles in the I-007eBooks library here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Reflections and Priorities: An Update to I-Connect007 Readers
06/24/2025 | Marcy LaRont, I-Connect007The electronics and manufacturing industry is evolving rapidly—with new technologies, deeper global connections, and a growing drive toward sustainability. To reflect these changes and our place in this dynamic space, we’re refreshing our brand.
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
06/24/2025 | Mike Konrad -- Column: The Knowledge BaseAs the electronics manufacturing industry races to meet rising global demand and technological complexity, the need for a highly skilled, future-ready workforce has never been greater. At the forefront of addressing this challenge is The Electronics Manufacturing & Assembly Collaborative (EMAC)—a national initiative dedicated to strengthening the talent pipeline through strategic collaboration with SMTA, education, and government stakeholders.
IPC Rebrands as Global Electronics Association: Interview With Dr. John W. Mitchell
06/22/2025 | Marcy LaRont, I-Connect007Today, following a major announcement, IPC is embracing the rapid advancement of technology with a bold decision to change its name to the Global Electronics Association. This name more accurately reflects the full breadth of its work and the modern realities of electronics manufacturing. In this exclusive interview, Global Electronics Association President and CEO Dr. John W. Mitchell shares the story behind the rebrand: Why now, what it means for the industry, and how it aligns with the organization’s mission.
Global Electronics Association Debuts; New Name Elevates IPC’s 70-Year Legacy as Voice of $6 Trillion Electronics Industry
06/25/2025 | Global Electronics AssociationToday begins a new chapter for IPC as it officially becomes the Global Electronics Association, reflecting its role as the voice of the electronics industry. Guided by the vision of “Better electronics for a better world,” the Global Electronics Association (electronics.org) is dedicated to enhancing supply chain resilience and promoting accelerated growth through engagement with more than 3,000 member companies, thousands of partners, and dozens of governments across the globe.