Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Koh Young Exhibits at Productronica India with Regional Sales Partners NMTronics and Panasonic Connect
August 31, 2023 | Koh YoungEstimated reading time: 1 minute
Koh Young, the industry leader in True 3D measurement-based inspection solutions, will be highlighting its revolutionary solutions at Productronica India 2023 with NMTronics India from 13-15 September 2023. There will be two machines covering automated pin inspection and dispense process inspection. Koh Young designed both to solve the difficult challenges faced in various production environments. Experience our latest solutions in the NMTronics booth PD01 Hall 4 or in the Panasonic Connect booth PB01 Hall 4 at BIEC, Bengaluru, India.
Solder Paste Inspection (SPI)
The KY8030-2 combines Koh Young’s patented 3D dual-projection Moiré technology, it effectively eliminates critical shadow and specular reflection challenges other 3D inspection systems simply cannot address. Meet KY8030-2 with multiple resolutions and configurable options to meet the needs of applications.
- KY8030 Series Industry’s Fastest True 3D SPI Solution with Integrated Auto-Repair Dispense Head
Automated Optical Inspection (AOI)
The Zenith Alpha is powered by artificial intelligence and machine learning, combining the best optomechatronics and vision technologies to deliver outstanding performance without sacrificing accuracy. Meet Zenith Alpha with multiple resolutions and configurable options to meet the needs of applications.
- Zenith Alpha Series Best Value True3D™ Automated Optical Inspection Solution
Automated Pin Inspection (API)
The complete KY-P3 lineup provides an automated back-end solution combining advanced high-resolution optics and innovative AI-powered vision algorithms for single pin, press-fit, and final optical inspection, as well as for pins in a connector shroud and traditional SMDs on the same board.
- KY-P3: Industry-awarded breakthrough in 3D Automated Pin Inspection
- KY-P3 Series Best-in-class Pin Measurement Accuracy and Inspection Reliability
Dispense Process Inspection (DPI)
The award-winning Neptune is the industry’s first 3D optical measurement solution for transparent material inspection. Using Koh Young LIFT technology, the Neptune delivers non-destructive 3D inspection to precisely measure and inspect fluids – wet or dry. The Neptune accurately measures materials for coverage, thickness, and consistency with a user-defined threshold setting.
- Neptune C+ Award-winning True3D In-Line Dispensing Process Inspection
Additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal. (Download the companion guide here.)
- I-007e Micro Webinar Series: “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna
You can view other titles in the I-007eBooks library here.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.