Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Inspection Technologies from Viscom at NEPCON Vietnam
August 31, 2023 | Viscom AGEstimated reading time: 1 minute
A well-prepared team from Viscom Asia is ready to welcome visitors to NEPCON Vietnam 2023 in Hanoi. Two machines will represent the wide range of inspection systems developed and manufactured at Viscom AG in Germany: iX7059 PCB Inspection XL (3D AXI) and S3088 ultra chrome (3D AOI). In combination, they cover 100% of today's post-reflow inspection requirements.
Whether research and development or production of high-end electronic devices, Vietnam is increasingly becoming a very important key player among Asian countries. This will also be evident at the International Centre of Exhibition (I.C.E.) in the country's capital from September 6 to 8. Viscom will be present at NEPCON Vietnam 2023 with its own booth No. V04. Under the vAI brand, for example, Viscom offers a growing portfolio of smart solutions in the field of artificial intelligence. NEPCON visitors will learn more about the advantages of AI in the verification process or, e.g., inspection program generation.
The exhibited iX7059 PCB Inspection XL inline X-ray system has already won the EM Innovation Award in the "X-ray inspection" category this year. Its special features include a revolutionary, fully dynamic 3D image acquisition concept with a new generation of flat panel detectors and the ability to inspect very long PCBs in lengths of up to 1600 mm (63"). High-quality 3D AXI volume calculations and slice images of the inspection areas enable, for example, the repeatably exact measurement of voids – based on high-performance planar CT.
The S3088 ultra chrome at the Viscom booth is a well-known 3D AOI system used in high-throughput production lines worldwide. For verification, it delivers true-to-life 360° renderings and color images from nine perspectives. Its advanced 3D camera technology is combined with extremely high inspection speed and outstanding inspection quality. All this is delivered as a standardized system configuration. The Viscom team is also available to answer questions about other inspection solutions, e.g., for solder paste, wire bonds, conformal coatings, or batteries.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.