-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCounterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Inspection Technologies from Viscom at NEPCON Vietnam
August 31, 2023 | Viscom AGEstimated reading time: 1 minute
A well-prepared team from Viscom Asia is ready to welcome visitors to NEPCON Vietnam 2023 in Hanoi. Two machines will represent the wide range of inspection systems developed and manufactured at Viscom AG in Germany: iX7059 PCB Inspection XL (3D AXI) and S3088 ultra chrome (3D AOI). In combination, they cover 100% of today's post-reflow inspection requirements.
Whether research and development or production of high-end electronic devices, Vietnam is increasingly becoming a very important key player among Asian countries. This will also be evident at the International Centre of Exhibition (I.C.E.) in the country's capital from September 6 to 8. Viscom will be present at NEPCON Vietnam 2023 with its own booth No. V04. Under the vAI brand, for example, Viscom offers a growing portfolio of smart solutions in the field of artificial intelligence. NEPCON visitors will learn more about the advantages of AI in the verification process or, e.g., inspection program generation.
The exhibited iX7059 PCB Inspection XL inline X-ray system has already won the EM Innovation Award in the "X-ray inspection" category this year. Its special features include a revolutionary, fully dynamic 3D image acquisition concept with a new generation of flat panel detectors and the ability to inspect very long PCBs in lengths of up to 1600 mm (63"). High-quality 3D AXI volume calculations and slice images of the inspection areas enable, for example, the repeatably exact measurement of voids – based on high-performance planar CT.
The S3088 ultra chrome at the Viscom booth is a well-known 3D AOI system used in high-throughput production lines worldwide. For verification, it delivers true-to-life 360° renderings and color images from nine perspectives. Its advanced 3D camera technology is combined with extremely high inspection speed and outstanding inspection quality. All this is delivered as a standardized system configuration. The Viscom team is also available to answer questions about other inspection solutions, e.g., for solder paste, wire bonds, conformal coatings, or batteries.
Suggested Items
KYZEN to Feature Understencil and PCB Cleaners at SMTA Tijuana
10/28/2024 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Tijuana Expo & Tech Forum, scheduled to take place Thursday, November 7, at Quartz Hotel Tijuana.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Space Coast Expo & Tech Forum
10/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Space Coast Expo & Tech Forum taking place on November 14 at the Melbourne Auditorium in Melbourne, Florida.
AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA South China Expo & Tech Forum
10/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA South China Expo & Tech Forum taking place November 6-7 at the Shenzhen World Exhibition & Convention Center in Shenzhen, China.
All Flex Solutions Invests in Assembly Inspection Automation
10/17/2024 | All Flex SolutionsAll Flex has acquired an Omron VP9000 3D Solder Paste Inspection System and an Omron VT-S1080 3D Automatic Optical Inspection System for their flexible circuit assembly facility in Bloomington, Minnesota. These acquisitions are one part of All Flex Solutions’ four-year SMT Roadmap to expand the scale and capability of their assembly operations.
TopLine to Exhibit 'Drop-in Replacement' for BGA at Electronica
10/16/2024 | TopLineTopLine Corporation will exhibit its latest technology solutions at Electronica in Munich, Germany, November 12 – 15, 2024, in stand B4.428.