Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
The September 2023 Issue of SMT007 Magazine Is Available Now
September 1, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Chips Don't Float!
In Europe and the U.S., legislation is under way to revitalize unified circuit manufacturing—PCB fabrication and packaging. To help make the most of this legislative work, industry advocates strive to make a difference by educating legislators and their staff on the electronics supply chain, including the dire need for local substrate sources. This gives rise to the rallying cry: “Chips don’t float!”
What is the status of this work as we approach the end of 2023, and how specifically does this change the industry landscape for EMS companies? What will all this mean to circuit assembly?
In this issue, we bring you a slice of the wide-ranging message industry advocates have been communicating on our behalf, along with a special introduction to the upcoming 2023 SMTA International Conference and Exhibition.
Quick review link: SMT007 Magazine
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