Marcy’s Musings: Advancing the Advanced Materials Discussion
The Marketing Minute: Cracking the Code of Technical Marketing
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 1, 2023 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
It must be almost fall; my air conditioning hasn’t switched on all day. I love living in Atlanta, but August was so hot that I thought I was going to melt.
As we head into the Labor Day weekend, we have a variety of articles for this week’s editor’s picks. Hannah Nelson discusses the onboarding process she went through when she started a new job. Gaurab Majumdar explains why tech companies should consider hiring workers from India. Happy Holden details the importance of great sensor technology and why sensors are a critical ingredient in Smart manufacturing processes. Mike Brask discusses the new IPS ENIG line installed at the SEL facility in Idaho, and Chris DeMartino explains how Modelithics works to provide simulation models, primarily for the RF/microwave community.
See you next time.
The New Chapter: Smoothing the Rocky Road of Onboarding
Published August 31
If you’ve ever moved to a new city to start a new job, Hannah Nelson’s newest column will ring true. She discusses what it was like to move from Indiana to Arizona for a job, how her new company welcomed her in and helped her onboard successfully, and what lessons she learned from the whole experience.
An Industry-ready Workforce in India
Published August 28
For about a decade, I’ve been reading news articles about India being at a crossroads. But according to IPC India Executive Director Gaurab Majumdar, the country may now be heading out on the highway with the accelerator floored. In this article, Gaurab explains why companies seeking technical staff should consider India, which has a large population of skilled technologists and college students ready to join the workforce.
It All Starts With Sensors
Published August 30
In this article, Happy Holden points out that manufacturing data collection begins with sensors. But the implementation of Smart processes requires much more than just great sensor technology, and you may have to upskill your staff or hire experts to take you to the finish line. As Happy says, “Time does not favor the procrastinator.”
Innovations in Final Finishing
Published August 31
One centerpiece of the new SEL facility in Idaho is the fully automated IPS ENIG line, which measures 81 feet in length. In this interview, IPS President Mike Brask explains how this line was custom-built for SEL to include a variety of features not usually seen in North America.
Model Citizens: Modelithics
Published August 28
We recently spoke with Chris DeMartino, an applications engineer at Modelithics, about the company’s business “model” of providing simulation models for the RF and microwave industries. Creating models is a tedious job for PCB designers and design engineers, so this could wind up being a real time-saver.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.