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Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 1, 2023 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
It must be almost fall; my air conditioning hasn’t switched on all day. I love living in Atlanta, but August was so hot that I thought I was going to melt.
As we head into the Labor Day weekend, we have a variety of articles for this week’s editor’s picks. Hannah Nelson discusses the onboarding process she went through when she started a new job. Gaurab Majumdar explains why tech companies should consider hiring workers from India. Happy Holden details the importance of great sensor technology and why sensors are a critical ingredient in Smart manufacturing processes. Mike Brask discusses the new IPS ENIG line installed at the SEL facility in Idaho, and Chris DeMartino explains how Modelithics works to provide simulation models, primarily for the RF/microwave community.
See you next time.
The New Chapter: Smoothing the Rocky Road of Onboarding
Published August 31
If you’ve ever moved to a new city to start a new job, Hannah Nelson’s newest column will ring true. She discusses what it was like to move from Indiana to Arizona for a job, how her new company welcomed her in and helped her onboard successfully, and what lessons she learned from the whole experience.
An Industry-ready Workforce in India
Published August 28
For about a decade, I’ve been reading news articles about India being at a crossroads. But according to IPC India Executive Director Gaurab Majumdar, the country may now be heading out on the highway with the accelerator floored. In this article, Gaurab explains why companies seeking technical staff should consider India, which has a large population of skilled technologists and college students ready to join the workforce.
It All Starts With Sensors
Published August 30
In this article, Happy Holden points out that manufacturing data collection begins with sensors. But the implementation of Smart processes requires much more than just great sensor technology, and you may have to upskill your staff or hire experts to take you to the finish line. As Happy says, “Time does not favor the procrastinator.”
Innovations in Final Finishing
Published August 31
One centerpiece of the new SEL facility in Idaho is the fully automated IPS ENIG line, which measures 81 feet in length. In this interview, IPS President Mike Brask explains how this line was custom-built for SEL to include a variety of features not usually seen in North America.
Model Citizens: Modelithics
Published August 28
We recently spoke with Chris DeMartino, an applications engineer at Modelithics, about the company’s business “model” of providing simulation models for the RF and microwave industries. Creating models is a tedious job for PCB designers and design engineers, so this could wind up being a real time-saver.
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Lockheed Martin’s Newest Technology Demo for Space Connectivity Is Ready for Launch
12/10/2024 | Lockheed MartinLockheed Martin’s newest technology demonstration, called the Tactical Satellite (TacSat), is complete and ready for launch in 2025 aboard a Firefly Aerospace Alpha rocket.
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
Lockheed Martin Wins MK-48 Mod 7 Guidance and Control System Contract Extension
12/09/2024 | Lockheed MartinThe U.S. Naval Sea Systems Command (NAVSEA) has awarded Lockheed Martin a $245 million dollar contract extension for the MK-48 Guidance and Control (G&C) Mod 7 program.
Foxconn Honored For Investor Relations Excellence In IR Magazine Awards
12/06/2024 | PRNewswireHon Hai Technology Group, the world's largest electronics manufacturing service provider, has been honored as winner of investor relations excellence in three major categories – Best In Sector, Best IR Officer, and Best Use Of Technology Including AI – in 2024 awards by IR Magazine, the globally recognized, definitive, independent voice in investor relations.
Biden-Harris Administration Announces CHIPS Incentives Awards with Absolics and Entegris
12/06/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.