Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
DuPont, YMT Collaborate to Enhance Riston Dry Film Photoresist Distribution and Service in Korea
September 5, 2023 | DuPontEstimated reading time: 2 minutes
DuPont Interconnect Solutions (DuPont) announced that it entered into a strategic collaboration relationship with YMT, a Korean printed circuit board (PCB) materials manufacturer listed on the KOSDAQ exchange. This collaboration combines DuPont’s circuit imaging material expertise and YMT’s local network, which can best address the local customer needs with faster response, better service, and a total solution. Under this collaboration, YMT has invested in establishing a dry film slitting facility in Ansan, Korea, and expects facility operation in October.
“YMT is one of the leading companies in the global chemical material industry with strong technology development capability. We are pleased to work with YMT to advance the electronic industry and build a more connected value chain to serve our customers in Korea,” said Yuan Yuan Zhou, Global Business Director, Metallization & Imaging, DuPont. Adding the local Riston® dry film photoresist slitting capability will largely accelerate Riston® product delivery and flexibility, heightening Korea’s local customer reach and better service. “We believe the win-win strategy will reinforce our circuit imaging market in Korea while YMT will expand its current product offerings by adding Riston® dry films,” said Zhou.
”We are excited by growing our relationship with DuPont. By aligning more fully with DuPont, we can leverage our strength in technical service and logistics to meet the varied needs of our customers as the industry continues to grow. We are confident that our collaboration will create long-term value for our customers,” said Peter Baek, Chief of Business Officer, Vice President, YMT.
DuPont and YMT will jointly showcase the Riston® dry film photoresist technology at YMT booth #E401 in the upcoming KPCA on Sept. 6-8, at Songdo Convensia, Incheon, Korea. At the show, DuPont and YMT will present a broad Riston® circuit imaging materials designed for fine-line applications and advanced PCB technology for high-end segments such as Integrated Circuit (IC) substrate, High-Density Interconnect (HDI) and Semi-Additive Process (SAP) to drive high-integration, high-performance, and miniaturization process development.
Exhibited Product List:
- Riston® DI1600 & DI1700 dry film photoresist, the advanced fine line direct imaging photoresist solution for IC substrate application
- Riston® SD2000 dry film photoresist, super fine line stepper photoresist solution for IC substrate and advanced packaging application
- Riston® TH2000 dry film photoresist, the advanced dry film photoresist solution for fine line HDI and FPC application
- Riston® WBR3000 dry film photoresist, the advanced solution for tall copper pillar process in the advanced packaging application
Share on:
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.