-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
MKS’ Atotech to Participate in SEMICON Taiwan 2023
September 5, 2023 | MKS’ AtotechEstimated reading time: Less than a minute

MKS’ Atotech will be participating at the upcoming SEMICON Taiwan, a business matching platform for Taiwan’s semiconductor industry. The event will take place at the TaiNEX Hall 1 and 2 in Taipei, Taiwan, from September 6 – 8.
Atotech® product experts will be available at booth K2270 in hall 1 to talk about the range of plating solutions to meet the diverse requirements of modern semiconductor devices. The current offer includes plating solutions to meet the diverse requirements of modern semiconductor devices. These solutions include electrolytic processes for various structures such as pillars, micro vias, fine line RDL, and solder applications for power semiconductors. Additionally, the portfolio encompasses a wide selection of tin processes, adhesion promoters, and post-treatments specifically designed for leadframes.
At the show, the following products will be highlighted:
- Spherolyte® Cu UF5 – Tailorable and pure high-speed copper pillar plating
- Spherolyte® Cu DB – Next gen Cu-to-Cu direct bonding
- Spherolyte® SnAg – High-speed SnAg for lead-free, pure and uniform solder bump plating
- Protectostan® Plus 3 – High performance “2-in-1” tin post-dip
- StannoPure® PF 10 – High-speed green tin process for leadframes and connectors
- AgPrep – A new NEAP solution that assures excellent adhesion and significant cost savings
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.