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MKS’ Atotech will be participating at the upcoming SEMICON Taiwan, a business matching platform for Taiwan’s semiconductor industry. The event will take place at the TaiNEX Hall 1 and 2 in Taipei, Taiwan, from September 6 – 8.
Atotech® product experts will be available at booth K2270 in hall 1 to talk about the range of plating solutions to meet the diverse requirements of modern semiconductor devices. The current offer includes plating solutions to meet the diverse requirements of modern semiconductor devices. These solutions include electrolytic processes for various structures such as pillars, micro vias, fine line RDL, and solder applications for power semiconductors. Additionally, the portfolio encompasses a wide selection of tin processes, adhesion promoters, and post-treatments specifically designed for leadframes.
At the show, the following products will be highlighted:
- Spherolyte® Cu UF5 – Tailorable and pure high-speed copper pillar plating
- Spherolyte® Cu DB – Next gen Cu-to-Cu direct bonding
- Spherolyte® SnAg – High-speed SnAg for lead-free, pure and uniform solder bump plating
- Protectostan® Plus 3 – High performance “2-in-1” tin post-dip
- StannoPure® PF 10 – High-speed green tin process for leadframes and connectors
- AgPrep – A new NEAP solution that assures excellent adhesion and significant cost savings
