Dan’s Biz Bookshelf: ‘The Future of Sales'
Driving Innovation: Traceability in PCB Production
It’s Only Common Sense: Price—Is That All You’ve Got?
MKS’ Atotech to Participate in SEMICON Taiwan 2023
September 5, 2023 | MKS’ AtotechEstimated reading time: Less than a minute
MKS’ Atotech will be participating at the upcoming SEMICON Taiwan, a business matching platform for Taiwan’s semiconductor industry. The event will take place at the TaiNEX Hall 1 and 2 in Taipei, Taiwan, from September 6 – 8.
Atotech® product experts will be available at booth K2270 in hall 1 to talk about the range of plating solutions to meet the diverse requirements of modern semiconductor devices. The current offer includes plating solutions to meet the diverse requirements of modern semiconductor devices. These solutions include electrolytic processes for various structures such as pillars, micro vias, fine line RDL, and solder applications for power semiconductors. Additionally, the portfolio encompasses a wide selection of tin processes, adhesion promoters, and post-treatments specifically designed for leadframes.
At the show, the following products will be highlighted:
- Spherolyte® Cu UF5 – Tailorable and pure high-speed copper pillar plating
- Spherolyte® Cu DB – Next gen Cu-to-Cu direct bonding
- Spherolyte® SnAg – High-speed SnAg for lead-free, pure and uniform solder bump plating
- Protectostan® Plus 3 – High performance “2-in-1” tin post-dip
- StannoPure® PF 10 – High-speed green tin process for leadframes and connectors
- AgPrep – A new NEAP solution that assures excellent adhesion and significant cost savings
Share on:
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.