American Made Advocacy: A Growing Presence in Washington in Turbulent Times
Punching Out: M&A North American PCB and EMS Deals for the First Half of 2025
Heraeus Electronics to Present Pastes for the Next Era of Mobility at SMTA International 2023
September 7, 2023 | Heraeus ElectronicsEstimated reading time: 1 minute
Heraeus Electronics is pleased to announce its participation at SMTA International, a premier event for electronics manufacturing and assembly professionals. The event is scheduled to take place Oct. 9-12, 2023 at the Minneapolis Convention center in Minneapolis, MN. Heraeus Electronics will present its groundbreaking Microbond® SMT660 Innolot and Microbond® SMT660 Innolot® 2.0 Solder Pastes, and showcase its exceptional sinter paste innovations, including the PE338 Silver and PE401 Copper Pressure Sinter Paste in Booth #1230.
Redefining Reliability and Cost Efficiency
Heraeus Electronics is revolutionizing the automotive industry with its Microbond® SMT660 Innolot® 2.0 solder alloy. This advanced solution offers an innovative approach to highly reliable and cost-effective solder alloys for automotive applications. By introducing the ability to maintain a competitive Total-Cost-of-Ownership (TCO) while meeting emerging requirements, Heraeus Electronics is setting new industry benchmarks. The next generation of Innolot® alloy enhances creep resistance, leading to extended product life cycles at higher operating temperatures. Notably, the Microbond® SMT660 Innolot® 2.0 solder paste excels in reflow without the need for additional N2, keeping defect rates low and reducing TCO.
Advancements in Flux Design for Enhanced Performance
The Microbond® SMT660 solder paste incorporates a flux designed to deliver superior performance. An acrylic-based synthetic resin eliminates potential batch-to-batch variations often associated with natural raw materials. This approach, combined with low impurities, results in a high Surface Insulation Resistance (SIR) performance, reducing the risk of electrochemical migration. This flux combined with Innolot® or Innolot® 2.0 alloy synergy offers exceptional reliability, making it especially valuable in miniaturized systems within the automotive industry.
Focus on Sinter Paste Innovations
During the event, Heraeus Electronics also will showcase its cutting-edge sinter paste innovations. The PE401 Copper Pressure Sinter Paste represents a breakthrough material for die attach applications of high-power packages. Known for forming highly reliable joints with excellent thermal conductivity, PE401 is both lead-free and devoid of halogens and nano particles.
The mAgic Pressure Sinter Paste PE338 and PE338 F1510 Sinter Pastes for stencil and screen printing improve device reliability and provide high electrical conductivity, improving device efficiency. The pastes have proven to enhance workability on copper surfaces and elevate performance longevity by integrating wide band gap materials such as SiC and GaN.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Weller Tools Supports Future Talent with Exclusive Donation to SMTA Michigan Student Soldering Competition
07/23/2025 | Weller ToolsWeller Tools, the industry leader in hand soldering solutions, is proud to announce its support of the upcoming SMTA Michigan Expo & Tech Forum by donating a limited-edition 80th Anniversary Black Soldering Set to the event’s student soldering competition.
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.