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Heraeus Electronics to Present Pastes for the Next Era of Mobility at SMTA International 2023
September 7, 2023 | Heraeus ElectronicsEstimated reading time: 1 minute
Heraeus Electronics is pleased to announce its participation at SMTA International, a premier event for electronics manufacturing and assembly professionals. The event is scheduled to take place Oct. 9-12, 2023 at the Minneapolis Convention center in Minneapolis, MN. Heraeus Electronics will present its groundbreaking Microbond® SMT660 Innolot and Microbond® SMT660 Innolot® 2.0 Solder Pastes, and showcase its exceptional sinter paste innovations, including the PE338 Silver and PE401 Copper Pressure Sinter Paste in Booth #1230.
Redefining Reliability and Cost Efficiency
Heraeus Electronics is revolutionizing the automotive industry with its Microbond® SMT660 Innolot® 2.0 solder alloy. This advanced solution offers an innovative approach to highly reliable and cost-effective solder alloys for automotive applications. By introducing the ability to maintain a competitive Total-Cost-of-Ownership (TCO) while meeting emerging requirements, Heraeus Electronics is setting new industry benchmarks. The next generation of Innolot® alloy enhances creep resistance, leading to extended product life cycles at higher operating temperatures. Notably, the Microbond® SMT660 Innolot® 2.0 solder paste excels in reflow without the need for additional N2, keeping defect rates low and reducing TCO.
Advancements in Flux Design for Enhanced Performance
The Microbond® SMT660 solder paste incorporates a flux designed to deliver superior performance. An acrylic-based synthetic resin eliminates potential batch-to-batch variations often associated with natural raw materials. This approach, combined with low impurities, results in a high Surface Insulation Resistance (SIR) performance, reducing the risk of electrochemical migration. This flux combined with Innolot® or Innolot® 2.0 alloy synergy offers exceptional reliability, making it especially valuable in miniaturized systems within the automotive industry.
Focus on Sinter Paste Innovations
During the event, Heraeus Electronics also will showcase its cutting-edge sinter paste innovations. The PE401 Copper Pressure Sinter Paste represents a breakthrough material for die attach applications of high-power packages. Known for forming highly reliable joints with excellent thermal conductivity, PE401 is both lead-free and devoid of halogens and nano particles.
The mAgic Pressure Sinter Paste PE338 and PE338 F1510 Sinter Pastes for stencil and screen printing improve device reliability and provide high electrical conductivity, improving device efficiency. The pastes have proven to enhance workability on copper surfaces and elevate performance longevity by integrating wide band gap materials such as SiC and GaN.
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Winners of IPC Hand Soldering and Rework Competition Vietnam 2024 Announced
09/19/2024 | IPCIn conjunction with NEPCON Vietnam 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam, September 11-13. Thirty-nine competitors from 16 electronics companies and one university in Vietnam vied for top honors.
Understanding Cleaning Challenges for Automated Solder Paste Dispensing
09/18/2024 | Debbie Carboni, KYZENIn today’s rapidly evolving electronics manufacturing landscape, staying abreast of innovative technologies is crucial. As solder paste and substrate materials continually evolve and become more complex, optimizing production methods with the latest technology ensures performance and quality while reducing operational costs.
Successful Rehm Technology Days 2024 – Where the Future Meets Technology
09/17/2024 | Rehm Thermal SystemsTraditionally, the Rehm Technology Days offer a valuable opportunity for knowledge exchange, networking and discussion. Once again this year, numerous customers, partner companies, press representatives and employees from the worldwide locations met at the company headquarters in Blaubeuren-Seissen.
Circuit Technology Center Announces Expanded Tinning Services Capacity
09/16/2024 | Circuit Technology CenterCircuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning.
The Knowledge Base: The Pivotal Role of Solder Paste
09/16/2024 | Mike Konrad -- Column: The Knowledge BaseIn the complex world of electronics manufacturing, the humble solder paste plays a pivotal role. Often overshadowed by more conspicuous electronics assembly equipment and materials, this blend of powdered metal and flux is the unsung hero that binds the electronic circuits together. But beyond its adhesive and conductive properties, the selection of the right solder paste is crucial for ensuring the long-term reliability of electronic devices.