Powering the Future: Why True Ceramic Circuits Are Not Just ‘Better PCBs’
Global Sourcing Spotlight: The Global Quality Gap—Why Consistency Wins the Contract
Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
The program for the SMTA International Technical Conference is finalized with 90 great papers presented across 30+ sessions. Each session features two to four presentations on a related topic and is organized into the following tracks:
Advanced Packaging (APT): Advances in first-level packaging and assembly
High Performance and Reliability (HPR): Addressing unique needs of electronics operating at more strenuous levels and in harsh environments
Interconnect Research and Reliability (IRR): Reliability testing and evaluation of soldering
Low Temperature Solder (LTS): Developments that can be reflow soldered below 200°C
Manufacturing Excellence (MFX): Current project work in manufacturing process areas
Materials for Electronics (MAT): New materials used in electronics assembly
Medical & Defense Symposium (MD): Reliability in mission-critical applications
Technical Innovations (TI): Manufacturing and materials that innovate the manufacturability and reliability of electronic circuit board assemblies and systems
Test and Inspection (INS): Ensuring product reliability short- and long-term
Women's Leadership Program (WLP): Promote diversity in engineering fields
There is industry buzz around “advanced packaging” and the 2023 Advanced Packaging (APT) track addresses some critical aspects of the topic. This year, APT has papers on new package materials and processes, including hybrid bonding and heterogeneous integration. There also are several papers on board level and package reliability.
Two read this entire article, which appeared in the September 2023 issue of SMT007 Magazine, click here.
