Dan’s Biz Bookshelf: ‘Innovation X: Why a Company’s Toughest Problems Are Its Greatest Advantage’
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
Fein-Lines: CES 2025—Highlighting the Future With Sony and NVIDIA
Saab Receives Order for Additional Functionality for Gripen E
September 13, 2023 | SaabEstimated reading time: Less than a minute
Saab and the Swedish Defence Materiel Administration (FMV) have entered into an agreement regarding new functionality and adjusted delivery schedules for Gripen E and Gripen C/D. The agreement relates to the period 2023-2030 and the order value is approximately SEK 5.8 billion.
FMV and Saab have agreed to revise their existing agreement regarding development and production of Gripen E by adding new functionality, which includes changes to the electronic warfare-, communication- and reconnaissance systems, as well as changes to the delivery schedules for Gripen E and Gripen C/D.
In order to secure the Swedish Armed Forces’ operative fighter capability, the Armed Forces, FMV and Saab have agreed on adjusted development- and delivery plans, enabling continued development and operation of Gripen C/D after 2030 in parallel with the introduction of the next generation fighter, Gripen E.
“This agreement further underlines the very close collaboration between Saab, FMV and the Swedish Armed Forces. I am very proud that we are contributing to the operative capability of the Armed Forces by further strengthening the capability of the Gripen system, which is a world-class fighter aircraft,” says Lars Tossman, head of Saab’s business area Aeronautics.
Share on:
Suggested Items
TSK Schill GmbH Closes 2024 With a Record Turnover
01/14/2025 | TSK Schill GmbHAt TSK, the course continues to be set for growth. Despite the turbulent market development, we were able to increase our turnover “EBIT”. We generated a large proportion of our turnover with Solution Business.
Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Gen Technologies and ‘Lab-to-Fab’ Ecosystem
01/13/2025 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
01/10/2025 | MicronMicron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.
NASA’s Kennedy Marks New Chapter for Florida Space Industry
01/09/2025 | NASAThe future of research and technology at NASA’s Kennedy Space Center in Florida is expanding Wednesday, as Kennedy’s center director and charter members in the Florida University Space Research Consortium signed a memorandum of understanding in research and development to assist with missions and contribute to NASA’s Moon to Mars exploration approach.
Biden-Harris Administration Announces Arizona State University Research Park as Planned Site for Third CHIPS for America R&D Flagship Facility
01/08/2025 | U.S. Department of CommerceThe Department of Commerce and Natcast announced the Arizona State University (ASU) Research Park in Tempe, Arizona as the anticipated location for the third flagship CHIPS for America research and development (R&D) facility.