Standard of Excellence: The Power of Personalization in Customer Care
Global Citizenship: Cultural Nuances Around the World
The Government Circuit: Four Things to Know About IPC Advocacy in 2025
MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
September 14, 2023 | MediaTekEstimated reading time: 1 minute
MediaTek and TSMC announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC, with both companies taking full advantage of their strengths in chip design and manufacturing to jointly create flagship SoCs with high performance and low power features, empowering global end devices.
“We are committed to our vision of using the world’s most advanced technology to create cutting edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek. “TSMC's consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.”
“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of the industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket,” said Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC. “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.”
TSMC’s 3nm process technology provides enhanced performance, power, and yield, in addition to complete platform support for both high performance computing and mobile applications. Compared with TSMC’s N5 process, TSMC’s 3nm technology currently offers as much as 18% speed improvement at same power, or 32% power reduction at same speed, and approximately 60% increase in logic density.
MediaTek's Dimensity SoCs, built with industry-leading process technology, are designed to meet the ever-increasing user experience requirements for mobile computing, high-speed connectivity, artificial intelligence, and multimedia. MediaTek’s first flagship chipset using TSMC’s 3nm process is expected to empower smartphones, tablets, intelligent cars and various other devices starting in the second half of 2024.
Share on:
Suggested Items
Accenture Invests in Voltron Data to Help Organizations Use GPU Technology to Simplify Large-Scale Data Processing
02/21/2025 | BUSINESS WIREAccenture announced an investment in Voltron Data, a company that is building software to unlock the next generation of accelerated computing that underpins modern AI applications. This investment, made through Accenture Ventures, will support Voltron Data in its efforts to help organizations use advanced computing technology to speed up large-scale analytics, used for generative AI and machine learning applications.
IonQ Announces Innovations in Compact, Room-Temperature Quantum Computing through XHV Technology
02/21/2025 | BUSINESS WIREIonQ, a leader in the quantum computing and networking industries, announced the completion of its next-generation ion trap vacuum package prototype intended to realize smaller, more compact, room temperature quantum systems.
Robotics Action Plan for Europe: VDMA Urges Policymakers to Boost Competitiveness
02/20/2025 | VDMAVDMA Robotics +Automation, the largest networking organization for the robotics industry in Europe, has issued a call to action to stop the loss of global competitiveness of European economies.
STMicroelectronics to Enable Higher-Performance Cloud Optical Interconnect in Datacenters and AI Clusters
02/20/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is unveiling its next generation of proprietary technologies for higher-performing optical interconnect in datacenters and AI clusters.
Are Domestic Assemblers Ready for the Next Level of Electronics Miniaturization?
02/19/2025 | Chrys Shea, SHEA Engineering ServicesUHDI technology is more than another evolutionary level of miniaturization. It’s a fundamental change in how we create circuit boards, on a scale potentially as impactful as the transition from through-hole to surface mount was 40 years ago.