- smt007 Magazine
In this issue, we (and AI) explored how and when artificial intelligence plays a role in manufacturing today. Whether on the factory floor, or in the front office, AI applications are emerging and changing how we approach planning, processes and problem solving.
- Events||| MENU
- smt007 Magazine
TRI to Unveil New High-Throughput AOI and AXI at productronica 2023September 15, 2023 | TRI
Estimated reading time: 1 minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2023, which will be held at Messe München Center from November 14 – 17, 2023. Visit booth No. A2-139 to experience TRI's newly released test and inspection solutions.
TRI will unveil the newly released Ultra-High-Speed 3D AOI, TR7700QH SII, capable of inspecting at speeds of up to 80 cm²/sec, maintaining uncompromised Gauge R&R. The TR7700QH SII is powered by TRI's Smart Programming, AI Algorithms, and Metrology measurement capabilities. Also exhibiting will be the newly released high throughput 3D AXI, TR7600 SV, which offers up to 20% performance improvement compared to the award-winning TR7600 series. Powered by AI Algorithms, the high-speed 3D AXI can precisely detect Void defects.
TRI will showcase the newly released high-speed multi-angle 3D AOI, TR7500QE Plus, equipped with four 20MP side cameras and 1 top high-resolution camera. TRI's lineup will include the enhanced 3D SPI TR7007DI Plus, the high-end 3D AXI TR7600F3D SII, and the Multi-core ICT with In-System LED Analysis function TR5001Q SII INLINE.
The AI solutions from TRI include the AI training tool, the AI Station, Verify Host, AI Smart Programming, and more. TRI Test and Inspection solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
TRI invites you to visit booth No. A2-139 at productronica 2023. Don't miss the opportunity to discuss with our experts how TRI solutions can enhance your production yield rate, reduce operational costs, and increase efficiency.
The practical question around CHIPS Act development and electronics assembly is, “Will this change how we do business?” Indium Corporation’s Dr. Andy Mackie sat down with Nolan Johnson to share what he sees as emerging answers to that question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI.
IPC continues to collaborate with the electronics manufacturing industry to meet their current and future workforce training needs.
Though product demand weakened this month with Orders and Backlog Indexes slipping, overall electronics industry operations remain healthy per IPC’s September 2023 Global Sentiment of the Electronics Supply Chain Report.
Rigid-flex circuits are unique structures; part rigid board and part flex, they’re increasingly working their way into many of the electronic devices we use every day. There have been many advances in rigid-flex lately as more companies find themselves exploring this technology. So, before I started writing this article about rigid-flex design, I double-checked a few things. Fortunately, there is plenty of rigid-flex information available on a variety of great websites that we all know and trust.
IPC Day France: Aerospace Electronics is an aerospace-focused networking event featuring key industry experts from NASA and Airbus and will take place on October 2, 2023 .