I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 15, 2023 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
It’s been a hot week in Atlanta. The Braves just clinched the division title with the best record in the league, 95-50, and Matt Olson tied the Braves’ franchise record with 51 home runs in one season (more than Hank Aaron ever hit in one year, if you’re a baseball history buff).
We’ve had a hot week in this industry too. In my picks for this week, we introduce a new SMT007 columnist, and we have a look at the CHIPS Act one year later. We have a great article about sourcing diversification, and a look at the latest electronics news coming out of India. And columnist Vern Solberg explains DFM best practices for flexible circuits.
Have a great weekend!
Meet Aidan Salvi of Amitron, SMT007 Columnist
Published September 14
This week, we welcomed Aidan Salvi to the I-Connect007 columnist roster. Aidan is the chief transformation officer for Amitron, and he’ll be covering the move from robots to cobots in PCB manufacturing. Check out his columns in the SMT007 and Mil-Aero newsletters.
Sourcing Diversification – Empowering Your Supply Chain for Success
Published September 13
The supply chain situation has stabilized now, but smart companies are being proactive and shoring up their sourcing processes, just in case. Léa Maurel of ICAPE has a great article about sourcing diversification and the need to foster relationships with multiple vendors from around the globe.
CHIPS Act, One Year On
Published September 12
It’s been one year since the CHIPS Act was introduced with a lot of hoopla and promises to fund the U.S. electronics industry. But where are we now? Has anything really changed? In this conversation, PCBAA Chair Travis Kelly lays it all out. He also discusses the Protecting Circuit Boards and Substrates Act that was recently reintroduced in Congress.
Designer’s Notebook: DFM Principles for Flexible Circuits
Published September 14
DFM practices can be challenging in the best of times, and things only get crazier when we move into flexible circuits. In this column, Vern Solberg discusses flex DFM techniques that designers need to keep in mind when working in the 3D flex environment.
Material Insight: India’s Rise in the Global Electronics Ecosystem
Published September 12
In this column, Preeya Kuray focuses on India’s continued expansion in the global electronics market. She discusses some of the electronics news from the Land of Many Wonders, including Micron’s plans to build a $2.75 billion advanced packaging factory in India. There’s a lot going on in India right now.
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.