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Pivoting on Substrates

09/27/2023 | I-Connect007 Editorial Team
Oved Shapira is CEO of PCB Technologies, the Israeli-based printed circuit provider. PCB Technologies has recently invested in facilities and expertise to design, fabricate, and assemble substrates, a key component for advanced packaging technologies. Oved spoke with Barry Matties and Nolan Johnson about how advanced packaging will influence the industry. He said it will shift everything, including design, fabrication, assembly techniques, and capital equipment development. Some of these shifts might be subtle, and others more seismic. Whatever the changes, Oved says it’s coming.

A Catalyst for Advanced Packaging and Substrates

09/26/2023 | Kirk Thompson, Isola Group
Despite being a leader in R&D investment in semiconductors and packaging with greater than $50 billion per year, the U.S. has seen its market share decrease to less than 3% in areas like advanced packaging and advanced substrates. The cause for this market share erosion was a laser focus in Asian countries to attract semiconductors and advanced packaging investment through ecosystem development and incentives. If the U.S. is serious about changing the momentum to onshore advanced packaging and advanced substrates, an ecosystem approach to innovation and manufacturing incentives must be employed. It is not enough to have the most innovative technology if the supply chain and manufacturing economics do not deliver competitive commercial opportunities.

Nolan's Notes: Convergence

09/19/2023 | Nolan Johnson -- Column: Nolan's Notes
When I stop to consider the dynamics in our industry at this moment, I keep coming back to the idea of “convergence.” Aspects of our industry historically thought of as distinct and separate are blurring the lines and overlapping. As I look back on our coverage in the past five years, I see convergence taking place, moving like a glacier—slow and steady but with formidable force. In this issue of PCB007 Magazine, the three areas of convergence we consider are materials, advanced packaging, and UHDI.

Achieve Optimal Uniformity with BTU’s TrueFlat Technology at SEMICON Taiwan

09/04/2023 | BTU International, Inc.
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will highlight its TrueFlat™ reflow oven technology at SEMICON Taiwan in booth #M1039. The expo is scheduled to take place September 6-8, 2023 at TaiNEX 1 & 2 in Taipei.

Celanese: Fired Up Over Ceramics

08/02/2023 | Nolan Johnson, I-Connect007
With the ever-increasing diversity of performance needs in printed circuits, substrates are an ongoing area of development and innovation. At IMS Microwave Week, we caught up with Daniel Barish, a global strategy and west commercial leader at Celanese, to discuss substrates, low temperature co-fired ceramics, in particular.
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