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UL-Authorization Received for Ventec High-CTI, Halogen Free FR15.1 Substrates VT-447C and VT-441C

02/27/2024 | Ventec
Ventec International Group Co., Ltd. , is pleased to announce that UL’s evaluation of two of Ventec’s halogen-free, phenolic cured high-CTI substrates have received authorization to apply the UL mark.

American Made Advocacy: Congress Must Handle Supply Chain Challenges in 2024

02/20/2024 | Travis Kelly -- Column: American Made Advocacy
It’s easy to get distracted in an election year. A constant stream of polls, primaries, and political prognostications will surely dominate the media cycle. Elections are important, but they should not distract the 118th Congress from the important work of securing our fragile supply chains and rebuilding microelectronics manufacturing capacity on our own shores.

EIPC Winter Conference 2024, Day 2: A Closer Look at Global Trends

02/14/2024 | Pete Starkey, I-Connect007
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.

Calumet Electronics, Schmid Group Collaborate to Establish First-Ever US Advanced Substrate Facility

02/13/2024 | SCHMID Group
Calumet Electronics, a leading American printed circuit board manufacturer is pioneering the domestic production of advanced packaging substrates.

EIPC Winter Conference 2024, Day 1: A Grab-bag of Technical Topics

02/12/2024 | Pete Starkey, I-Connect007
The 2024 Winter Conference of the EIPC took place January 30 and 31 at the IHK Academie in Villingen-Schwenningen, Germany. The keynote session will be reported separately. Here is my review of the first day’s conference proceedings.
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