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Designers Notebook: Implementing HDI and UHDI Circuit Board Technology

10/23/2024 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.

Counterfeit Concerns: Navigating the Risks

10/23/2024 | Nolan Johnson, SMT007 Magazine
Nolan Johnson meets with Diganta Das, PhD, and Michael Azarian, PhD, research scientists at the CALCE Electronic Products and Systems Center at the University of Maryland, to discuss the increasing issue of counterfeiting in the electronics and assembly industry. Diganta and Michael highlight the need for robust detection methods and standards to mitigate risks, specifically referencing SAE AS6171 for inspection and AS5553 for counterfeit mitigation. They cover real-world cases, like counterfeit network equipment scandals to relatively simple issues of consumer electronics accessories to illustrate the complexity of the issue and debate the philosophical implications of labeling products that contain a few minor counterfeit components as “counterfeit.”

TRI to Exhibit Test and Inspection Solutions at SMTA Tijuana Expo

10/21/2024 | TRI
Test Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, will be participating in the SMTA Tijuana Expo & Tech Forum 2024 at the Quartz Hotel Tijuana, Tijuana, Baja California, Mexico on November 7, 2024.

Connect the Dots: Designing for Reality—Pattern Plating

10/16/2024 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.

Vitronics Soltec Unveils Advanced Heavy Board Options for Reflow Soldering System

10/15/2024 | Vitronics Soltec
Vitronics Soltec, a leader in reflow soldering technology, announces the launch of new Heavy Board options for its industry-leading Centurion 1240 reflow soldering system.
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