Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
BTU International Partners with SMarTsol to Showcase Locally Built Pyramax Reflow Oven at SMTA Guadalajara Expo
September 20, 2023 | BTU International, Inc.Estimated reading time: 1 minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is joining forces with SMarTsol Technologies at the upcoming SMTA Guadalajara Expo, scheduled to take place Oct. 25-26, 2023 at the Expo Guadalajara in Guadalajara in Jalisco, Mexico. The spotlight of the event will be the locally built Pyramax 125 Air model, representing the recently announced reflow oven manufacturing capabilities available now in Mexico.
Local Manufacturing Strength Meets North American Demand
BTU International's decision to manufacture the Pyramax 125 Air reflow oven in Mexico underscores the company's unwavering commitment to meeting the needs of its North American customers. This strategic move leverages Mexico's robust manufacturing infrastructure and skilled workforce, reinforcing BTU International's dedication to delivering cutting-edge thermal processing solutions efficiently and effectively.
Pyramax 125 Air Model: Excellence in Thermal Processing
The Pyramax 125 Air model stands as a prime example of BTU International's dedication to innovation and excellence. Built with precision and care in Mexico, this model represents the pinnacle of thermal processing technology. It offers a host of advanced features including closed-loop convection control and the Wincon 8 oven control system, ensuring superior performance and reliability in a compact footprint.
"Our commitment to local manufacturing is not only a testament to our confidence in the Mexican manufacturing industry but also a demonstration of our dedication to serving our valued North American customers,” said Rob DiMatteo, General Manager, at BTU International. “We invite attendees to see this locally built Pyramax reflow oven at the SMarTsol booth in Guadalajara,” added DiMatteo.
Don't miss the opportunity to explore the locally built Pyramax 125 Air model and learn more about BTU International's commitment to meeting North American demands with excellence.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).