Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Altus Group Ireland Partners with SMT Thermal Discoveries to Enhance Electronics Manufacturing in Ireland
September 21, 2023 | Altus GroupEstimated reading time: 2 minutes
Altus Group, a leading supplier of capital equipment and services to the electronics manufacturing industry, has signed an agreement with SMT Thermal Discoveries to distribute its advanced reflow soldering and thermal technology solutions in Ireland.
With over 30 years of expertise in thermal engineering for electronics manufacturing, SMT Thermal Discoveries offers cutting-edge convection reflow, curing, and thermal testing equipment. Their innovative product portfolio will significantly expand and strengthen Altus’ solutions for Irish customers across various electronics sectors.
Altus has recently celebrated significant milestones and growth of its Irish division, including welcoming three new pivotal team members, inaugurating a state-of-the-art demonstration facility, and enhancing its portfolio by adding leading brands, including Essemtec and PVA. The partnership with SMT Thermal Discoveries demonstrates Altus’ continued commitment to expanding its offerings and service capabilities for customers in the region.
"We are pleased to partner with such a well-respected and established industry leader like SMT Thermal Discoveries," said Gareth Fenton, Sales Manager of Altus Group Ireland.
‘’It seems as though good news is coming thick and fast for the Irish team, and partnering with SMT Thermal Discoveries is a great new addition to the Irish team brand portfolio, complementing our turnkey offering across the SMT assembly process.”
Daniel Hamann, European Sales Manager at SMT Thermal Discoveries, said: "Altus Group's technical expertise, customer focus, and passion for growth make them an ideal partner. We are delighted to agree on a new partnership with Altus to be our local partner in the Irish region.
"We are confident this partnership will be very successful and look forward to leveraging our combined strengths to bring innovations, solutions, and service capabilities to Altus’ customers in Ireland."
"SMT Thermal Discoveries offers an extensive range of solutions tailored to the specific needs of our customers in Ireland,” said Gareth. “With a strong local customer base already in place, the groundwork has been laid, and I am enthusiastic about the possibilities that lie ahead. With Daniel and the SMT technical team's support, we aim to further enhance our success by providing our customers with comprehensive turnkey SMT assembly capabilities."
This partnership is set to provide Irish electronics manufacturers with advanced yet accessible production solutions to help streamline processes, improve quality control, enhance efficiency, and increase productivity. By distributing SMT Thermal Discoveries' innovative portfolio Altus is providing their customers with state-of-the-art, automated tools to optimise manufacturing output while controlling costs effectively.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Indium to Showcase Sustainable Solder Paste and Alloy Technologies at Detroit Battery Show
10/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, automotive, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at The Battery Show North America, to be held October 7-9 in Detroit, Michigan.