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Real Time with... productronica 2023: Koh Young Discusses Semiconductor and Advanced Packaging Inspection

11/27/2023 | Real Time with...productronica
Koh Young’s Harald Eppinger talks about the company’s technology for the semiconductor and advanced packaging market and how they address the challenges introduced by reflective components and micro solder deposits.

HyRel Technologies Attains ITAR Registration, Reinforcing Leadership in Robotic Solder Component Tinning

11/27/2023 | HyRel
HyRel Technologies, a global provider of quick turn semiconductor modification solutions, announces the achievement of International Traffic in Arms Regulations (ITAR) registration.

Altus Helps Sellectronics Advance Component Management with Scienscope Technology

11/27/2023 | Altus Group
Altus Group, a leading distributor of electronics assembly equipment in the UK and Ireland, has helped Sellectronics, an innovative contract electronics manufacturer to significantly improve its component inventory management through the implementation of the Scienscope AXC-800 III automated X-ray component counter.

iNEMI Tech Topic Series: Counterfeit Components

11/24/2023 | iNEMI
iNEMI Tech Topic Series: Counterfeit Components, Emerging Trends in Counterfeit Detection and Mitigation, will be held Thursday, December 7, 2023 / 11:00 a.m.—12:30 p.m. EST (US).

Mek Launches the SpectorBOX X1: A Revolution in 3D THT Inspection

11/24/2023 | Mek (Marantz Electronics)
Mek (Marantz Electronics), a leader in Automated Optical Inspection (AOI) solutions, used last weeks’ Productronica show in Munich to proudly introduce the SpectorBOX X series, a modular full 3D AOI system for THT solder joints and THT components.
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