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Thermaltronics to Showcase Cutting-Edge Soldering Solutions at SMTA Guadalajara Expo & Tech Forum
September 21, 2023 | Thermaltronics USA, Inc.Estimated reading time: 1 minute
Thermaltronics USA, Inc., a globally acclaimed manufacturer of Precision Soldering Robots and innovative Curie point soldering systems, is excited to announce its participation in the highly anticipated SMTA Guadalajara Expo & Tech Forum, scheduled to take place from October 25-26, 2023. The event will be held at The Guadalajara Expo & Tech Forum, and attendees are invited to visit booth #114 to witness firsthand the cutting-edge soldering solutions offered by Thermaltronics.
TROIKA LATIN AMERICA, Thermaltronics’ esteemed representative in Mexico, will be showcasing the company's groundbreaking soldering technologies at the expo. Gerardo Rodriguez, the principal of TROIKA LATIN AMERICA, expressed his enthusiasm for the event, stating, “We are thrilled to provide attendees with an opportunity to experience the advanced capabilities of Thermaltronics’ Soldering Robot and Curie point soldering systems.”
The SMTA Guadalajara Expo & Tech Forum comes at a crucial juncture, with the manufacturing industry witnessing a surge in activity coupled with a shortage of skilled labor. In this context, the advantages of automating the soldering process have never been more apparent. Gerardo is confident that Thermaltronics' Soldering Robot will not only address these challenges but also redefine the standards of efficiency and precision.
Thermaltronics’ participation in the expo underscores its unwavering commitment to innovation. The company's Precision Soldering Robots and Curie point soldering systems are designed to revolutionize the electronics manufacturing industry by enhancing productivity, precision, and reliability.
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IPC Announces UK Regional Qualification for Hand Soldering Competition
01/02/2025 | IPCIPC invites skilled soldering experts to participate in the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) on February 4-6, 2025, at the Farnborough International Exhibition Centre.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.