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Thermaltronics to Showcase Cutting-Edge Soldering Solutions at SMTA Guadalajara Expo & Tech Forum
September 21, 2023 | Thermaltronics USA, Inc.Estimated reading time: 1 minute

Thermaltronics USA, Inc., a globally acclaimed manufacturer of Precision Soldering Robots and innovative Curie point soldering systems, is excited to announce its participation in the highly anticipated SMTA Guadalajara Expo & Tech Forum, scheduled to take place from October 25-26, 2023. The event will be held at The Guadalajara Expo & Tech Forum, and attendees are invited to visit booth #114 to witness firsthand the cutting-edge soldering solutions offered by Thermaltronics.
TROIKA LATIN AMERICA, Thermaltronics’ esteemed representative in Mexico, will be showcasing the company's groundbreaking soldering technologies at the expo. Gerardo Rodriguez, the principal of TROIKA LATIN AMERICA, expressed his enthusiasm for the event, stating, “We are thrilled to provide attendees with an opportunity to experience the advanced capabilities of Thermaltronics’ Soldering Robot and Curie point soldering systems.”
The SMTA Guadalajara Expo & Tech Forum comes at a crucial juncture, with the manufacturing industry witnessing a surge in activity coupled with a shortage of skilled labor. In this context, the advantages of automating the soldering process have never been more apparent. Gerardo is confident that Thermaltronics' Soldering Robot will not only address these challenges but also redefine the standards of efficiency and precision.
Thermaltronics’ participation in the expo underscores its unwavering commitment to innovation. The company's Precision Soldering Robots and Curie point soldering systems are designed to revolutionize the electronics manufacturing industry by enhancing productivity, precision, and reliability.
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05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.