Cadence Custom/Analog Design Migration Flow Accelerates Adoption of TSMC Advanced Process Technologies
September 26, 2023 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
Cadence Design Systems, Inc. announced the expansion of its node-to-node design migration flow based on the Cadence® Virtuoso® Studio, which is compatible with all TSMC advanced nodes, including the latest N3E and N2 process technologies. This generative design migration flow was developed by Cadence and TSMC to provide joint customers with a simplified and automated approach to migrating custom and analog IC designs among TSMC’s advanced process technologies. Customers already using the flow have successfully reduced migration time by up to 3X when compared with manual migration.
Virtuoso Studio facilitates the migration of schematic cells, parameters, pins and wiring from one TSMC process node to another. The Virtuoso ADE Suite’s simulation and circuit optimization environment then tunes and optimizes the new schematic to ensure the design achieves all required specifications and measurements. Cadence and TSMC customers can then automatically recognize and extract groups of devices in an existing layout, and apply them to similar groups in the new layout, using Virtuoso Layout Suite’s generative design technology.
This flow allows customers to migrate a wide range of analog designs on TSMC process technologies. TSMC process nodes supported by this flow include:
- N40 to N22
- N22 to N12
- N12 to N6
- N6 to N4
- N5 to N3E
- N4/N5 to N3E
- N3E to N2
“Many TSMC customers are looking to migrate legacy designs to TSMC advanced processes to take full advantage of the higher performance and lower power benefits that TSMC provides,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “We have worked closely with Cadence to offer our mutual customers the ability to easily migrate their valuable custom IP. These enhanced PDKs and methodologies simplify and accelerate the design migration process and speed time to market.”
“Through the expansion of our collaboration with TSMC on custom/analog process migration, our joint customers benefit from our generative technologies that make custom/analog migration simpler and less time-consuming,” said Tom Beckley, senior vice president and general manager in the Custom IC & PCB Group at Cadence. “Using our new Virtuoso Studio, we’ve developed an advanced migration flow to help our mutual customers be more productive and meet stringent time-to-market goals.”
Cadence Virtuoso Studio supports the Cadence Intelligent System Design™ strategy, enabling system-on-chip (SoC) design excellence.
Suggested Items
Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs
04/03/2025 | PRNewswireAnsys announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology. PathFinder-SC delivers a novel verification solution that provides superior capacity and performance, easily accommodating large designs in the cloud.
TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity
03/13/2025 | TSMCMediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.
SIA Applauds TSMC’s Expanded Investment in U.S. Semiconductor Manufacturing
03/10/2025 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from President and CEO John Neuffer regarding the announcement this week by C.C. Wei of TSMC and President Trump.
TSMC Intends to Expand Its Investment in the United States to $165 Billion to Power the Future of AI
03/04/2025 | TSMCTSMC announced its intention to expand its investment in advanced semiconductor manufacturing in the United States by an additional $100 billion.
Siemens Delivers Certified and Automated Design Flows for TSMC 3DFabric Technologies
02/17/2025 | SiemensSiemens Digital Industries Software announced, as part of its ongoing collaboration with TSMC, the readiness of an automated and certified workflow for TSMC’s InFO packaging technology using Siemens industry-leading advanced packaging integration solutions.