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ESMC Breaks Ground on Dresden Fab

08/20/2024 | TSMC
ESMC – a joint venture between TSMC, Robert Bosch GmbH, Infineon Technologies AG and NXP Semiconductors N.V. –held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany.

Foundry Market Shows Mixed Conditions with Price Adjustments for Specific Chinese Processes and Anticipated Price Increases for Taiwanese Advanced Processes

06/19/2024 | TrendForce
TrendForce reports that mid-year trends such as China’s 618 sales festival, the launch of new smartphones in 2H24, and the anticipated holiday sales season have driven inventory replenishment in the supply chain—positively impacting foundry capacity utilization and signaling a recovery from its operational low point.

TSMC Launches 'Eco Plus! - Ecological Harmony Program' to Enhance Green Conservation in Three Key Aspects

05/22/2024 | TSMC
As the challenge of climate change continues to grow, preserving ecosystems and natural environments has become a crucial part of achieving sustainable development.

TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips

04/30/2024 | PRNewswire
Ansys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.

TSMC Celebrates 30th North America Technology Symposium

04/29/2024 | TSMC
TSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.
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