Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
iNEMI/ZESTRON Workshop on Reliability & Standards for Automotive Electronics
September 27, 2023 | iNEMIEstimated reading time: Less than a minute
Join iNEMI and ZESTRON in Shenzhen on October 13 for a full-day workshop on reliability requirements and challenges for automotive electronics and to share the latest information about standards development for this market segment.
The rapidly growing automotive electronics sector is driving development of new materials and technologies which pose new challenges and reliability concerns. This interactive forum will give participants the opportunity to discuss and share knowledge and experiences on topics such as:
- Material and technology trends for automotive electronics
- Current reliability issues affecting electronics in EVs, including material characterization, failure analysis, reliability design, etc.
- Identify knowledge gaps and collaboration opportunities to mitigate reliability risks and improve yield and quality
- Standards development/revision and deployment
The agenda includes speakers from AT&S, Continental, CRRC, Indium Corporation, iNEMI, Keysight Technologies, NIO and ZESTRON. You’ll have the opportunity to meet and network with technical leaders and experts from the automotive electronics supply chain, including representatives from such companies as BYD, CATL and Geely. Plus, the event includes a visit to the ZESTRON South China Analytical Center & Technical Center.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.
SEL Showcases Global Factories and Product Development Journey for Manufacturing Day
10/10/2025 | SELSEL is celebrating Manufacturing Day 2025 with the release of a new video showcasing its product development and vertically integrated manufacturing process.
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.