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The End of Solder?
September 28, 2023 | Nolan Johnson, I-Connect007Estimated reading time: Less than a minute
The practical question around CHIPS Act development and electronics assembly is, “Will this change how we do business?” Indium Corporation’s Dr. Andy Mackie sat down with Nolan Johnson to share what he sees as emerging answers to that question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI.
When we talk about the CHIPS Act, that leads to a discussion about the assembly process, as they seem so interrelated.
Certainly. As the CHIPS Act money started rolling out last year, IPC hosted a conference in Washington, D.C. to point out that semiconductor chips do not exist in a vacuum; they are part of an electronics ecosystem that includes interconnection and protection. Therefore, U.S.-based packaging and assembly would be needed, alongside U.S. chip fabrication. This appeared to be news to many. The role of solder in advanced packaging has been changing over the years, but solder will continue to be needed.
To read this entire conversation, which appeared in the September 2023 issue of SMT007 Magazine, click here.
Suggested Items
Department of Commerce Awards CHIPS Incentives to Micron for Idaho and New York Projects
12/12/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Micron Technology up to $6.165 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award follows the previously signed preliminary memorandum of terms, announced on April 25, 2024, and the completion of the Department’s due diligence.
SIA Applauds Announcement of CHIPS Act Incentives for Micron Projects
12/11/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding the U.S. Department of Commerce and Micron for finalizing semiconductor manufacturing incentives for new projects in Boise, Idaho and Clay, New York, as well as announcing new incentives for Micron’s planned expansion in Manassas, Virginia.
Sondrel Now Shipping Chips as Part of a Complete Turnkey Project
12/09/2024 | SondrelSondrel has announced that it is now shipping finished chips to a US customer as part of a full turnkey contract of concept to silicon. The chips are accelerators for AI, which is one of Sondrel’s speciality areas as it requires high performance, ultra-complex custom designs on leading edge nodes.
SIA Commends CHIPS Act Incentives for Coherent, SkyWater Technology, X-FAB
12/09/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce, Coherent, SkyWater Technology, and X-FAB.
Biden-Harris Administration Announces CHIPS Incentives Awards with Absolics and Entegris
12/06/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.