Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
Indium’s Wisdom Qu to Present at SMTA China South Technical Conference
September 29, 2023 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Regional Product Manager Wisdom Qu will present at the SMTA China South Technical Conference, held in conjunction with NEPCON Asia, on October 11 in Shenzhen, China.
Qu will present on the challenges of large BGA warpage and the use of low-temperature soldering processes to solve those challenges. With the rapid growth of 5G computing and AI, the high integration design of CPU/GPU BGAs poses typical challenges for the electronics assembly industry. Large BGA and PCB HDI design and mismatched coefficients of thermal expansion have become more severe. These challenges can result in excessive warpage of BGAs during the manufacturing process, resulting in a number of solder defects.
“To reduce thermal deformation in BGAs and PCBs, the industry is exploring the use of low-temperature soldering processes,” said Qu. “Bi/Sn-based low-temperature solder alloys, with their lower melting points, can decrease thermal stress during the soldering process, thereby reducing thermal deformation.”
As Regional Product Manager for PCB Assembly Solder Paste in Asia, Qu facilitates business development and growth of PCB assembly product offerings, focusing on solder paste. A certified SMT process engineer, she has more than 17 years of experience in surface mount technology and earned a degree in mathematics from Hubei Radio and Television University in China.
Share on:
Suggested Items
TPCA Elects New Leadership, Strengthening Taiwan's PCB Industry Competitiveness
03/20/2025 | TPCAThe Taiwan Printed Circuit Association (TPCA) held its 12th Board of Directors election, membership meeting, and benchmarking forum on March 18, 2025, with over 300 member representatives participating.
NextFlex Launches $5M Funding Opportunity to Strengthen US Electronics Industrial Base
03/20/2025 | PRNewswireNextFlex, the Department of Defense (DoD) sponsored manufacturing innovation institute focused on maturing hybrid electronics, released Project Call 10.0 (PC 10.0), its latest call for proposals that seek to fund projects that further the development and adoption of hybrid electronics while addressing key challenges in advanced manufacturing.
Electronics Manufacturers Double Down on Sustainability Efforts Despite Challenges, According to New Report by IPC
03/18/2025 | IPCEvolve debuted today at IPC APEX EXPO as a comprehensive program designed to help electronics companies move sustainability forward on an accelerated path. IPC, the global electronics association, created Evolve in direct response to research showing an increased interest across the industry in sustainability efforts and product circularity.
Dan’s Biz Bookshelf: The Ten Faces of Innovation
03/14/2025 | Dan Beaulieu -- Column: Dan's Biz BookshelfInnovation is often misunderstood as a mystical process, something only geniuses or lucky individuals can master. In "The Ten Faces of Innovation," Tom Kelley, with the help of Jonathan Littman, demystifies the concept by offering an insightful and practical framework that anyone can adopt to foster creativity and drive meaningful change in their organizations.
KYOCERA AVX Joins the STMicroelectronics Partner Program
03/10/2025 | PRNewswireKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, is proud to join the STMicroelectronics Partner Program and make its antenna products and services accessible to ST customers.