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This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
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Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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KYZEN’s Debbie Carboni to Present in Panel Session at IPC High Reliability Forum
October 2, 2023 | KYZEN'Estimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, announced that Debbie Carboni, Global Product Line Manager - Electronics, will present as part of the Electric Vehicle (EV) panel during the IPC High Reliability Forum. The presentation entitled, “Revving Up Reliability: Connect, Clean and Cost for Electric Vehicle Excellence,” will take place Wednesday, Oct. 18, 2023, from 8:40 to 10:00 a.m. at the Hilton Baltimore BWI Airport in Linthicum, MD.
Carboni will be one of three presenters including Brian O’Leary of Indium and Brian Chislea of Dow. During the panel session, Carboni will represent KYZEN’s involvement in a collaborative study conducted with fellow industry leaders. She will offer insights to improve uptime performance to mitigate costly warranty repairs and enhance customer satisfaction.
The EV Panel session will focus on the resolution of durability concerns regarding PCBAs in e-Mobility infrastructure encompassing electric vehicles, charging stations, and Battery Energy Storage Systems. The overall goal of the session is to provide practical strategies for enhancing reliability in e-Mobility components and optimize overall user experience. The session will also consider assembly design challenges and offer solutions for constructing more dependable systems.
The IPC High Reliability Forum provides a unique opportunity for attendees to learn about the latest advancements in electronics, participate in industry discussions, and network within the respected community of professionals focused on electronics with high reliability requirements.
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Road to Reliability: Mapping the EV Landscape: Markets, Platforms, and Powertrains
10/28/2025 | Stanton Rak, SF Rak Companye-Mobility is the defining transformation of 21st-century transportation. As legacy OEMs, startups, and governments race to electrify vehicle fleets, the landscape of e-Mobility is expanding into previously unimaginable territory. But with innovation comes complexity, and with complexity, a need for systems that are not only high-performing but also reliably engineered for the long haul. Understanding the diversity and scale of the EV marketplace is essential to grasping the reliability challenges ahead. From compact urban commuters to heavy-duty trucks and city buses, each category of EV presents distinct performance demands and environmental challenges that shape both the design of its electronics and the manufacturing processes behind them.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.
SEL Showcases Global Factories and Product Development Journey for Manufacturing Day
10/10/2025 | SELSEL is celebrating Manufacturing Day 2025 with the release of a new video showcasing its product development and vertically integrated manufacturing process.