The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Smart Automation: AI—Revolutionizing Inspection in Electronics Manufacturing
Standard of Excellence: The Role of Technology in Enhancing the Customer Experience
Indium’s Wisdom Qu to Present at iNEMI Workshop on Automotive Electronics
October 2, 2023 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Regional Product Manager Wisdom Qu will present at the iNEMI Workshop on Automotive Electronics on October 13, in Shenzhen, China.
In her presentation Low-Voiding, High-Reliability, Lead-Free Solder Paste Design for Automotive Applications, Qu will examine the results of a test comparing a solder paste based on a mixed powder technology, containing Sn/Ag/Cu/Bi/Sb/In in the final joint, with SAC305 and other high-reliability pastes. The voiding from a QFN package was consistently lower than 15%, which is better than SAC305. TCT reliability under AEC Grade 1 for BGA192, QFN, and chip-resistor also demonstrated improved reliability compared to SAC305 and the other high-reliability alloys.
With the rapid growth of the 5G and EV markets, the electronics industry has higher requirements for product reliability, with the extended lifetime under AEC Grade 1 or even Grade 0 conditions. Traditional high-reliability solder alloys contain five or six elements or even more, which strengthens through solid solution and/or precipitate solution.
“The microstructural complexity of the multi-element high-reliability alloys makes the melting behavior complicated, which may lead to worsened voiding performance compared to traditional SAC305 after reflow,” said Qu. “Designing the solder paste with mixed powder technology can reduce voiding by using at least one ternary or quaternary alloy powder constituent in the paste while the final joint is still a quinary or even senary alloy system.”
As Regional Product Manager for PCB Assembly Solder Paste in Asia, Qu facilitates business development and growth of PCB assembly product offerings, focusing on solder paste. A certified SMT process engineer, she has more than 17 years of experience in surface mount technology and earned a degree in mathematics from Hubei Radio and Television University in China.
Share on:
Suggested Items
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.
Advancements in High-reliability Alloys for Automotive and High-performance Applications
05/22/2025 | Barry Matties, I-Connect007At IPC APEX EXPO, MacDermid Alpha Electronic Solutions showcased its latest innovations in SMT assembly materials designed to meet the growing demands for reliability and sustainability in automotive and high-performance applications. In this interview, Ebad Rehman, business product manager, discusses the evolution of high-reliability alloys, spotlighting ALPHA Innolot, a proven solution developed in response to the automotive industry’s increasing expectations for durability and performance under harsh operating conditions.
Trouble in Your Tank: Yield Improvement and Reliability
05/22/2025 | Michael Carano -- Column: Trouble in Your TankThere’s a simple rule of business in manufacturing: “It is all about yields.” Higher yields for your products allow for increased profits and satisfied customers. When there are lower yields, overall cost to manufacture increases, and the additional time and strain on the factory floor affect the entire operation. Lower yields are often the result of “process drift,” when critical process parameters and specialized plating additives fall outside their acceptable ranges.
Indium to Feature Power Electronics Solutions at SEMICON Southeast Asia 2025
05/19/2025 | Indium CorporationAs a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia 2025, May 20–22, in Marina Bay Sands, Singapore.
The Test Connection Inc. Appoints USM Reps as Exclusive Sales Representative in Mexico
05/13/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the appointment of USM Reps as its exclusive sales representative in Mexico.