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ZESTRON's Dr. Denis Barbini to Present at SMTA International
October 3, 2023 | ZESTRONEstimated reading time: Less than a minute
ZESTRON, a leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is excited to announce that Dr. Denis Barbini, Technical Solutions Manager at ZESTRON, will present "Utilizing SIR and Analytical Tools to Determine Impact to Reliability for Process Improvements" at the upcoming SMTA International Conference and Exhibition.
The presentation will delve into the challenges the electronics manufacturing industry faces when implementing new processes, machinery, or materials under Reision H of IPC-J-Std-001. Dr. Barbini, an industry expert with years of experience in the field, will explore how implementing advanced methodologies, such as Surface Insulation Resistance (SIR) testing and other analytical tools, can provide valuable insights into the reliability impact of process enhancements. Attendees will gain understandings into strategies for evaluating the efficacy of cleaning solutions, materials, and processes, ultimately ensuring that product reliability is not compromised.
For more information about ZESTRON's participation in SMTA International or to learn about their advanced cleaning solutions, visit ZESTRON at booth #1401 during the exhibition.
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Brent Fischthal - Koh YoungSuggested Items
Mapping the EV Landscape: Markets, Platforms, and Powertrains
10/28/2025 | Stanton Rak, SF Rak Companye-Mobility is the defining transformation of 21st-century transportation. As legacy OEMs, startups, and governments race to electrify vehicle fleets, the landscape of e-Mobility is expanding into previously unimaginable territory. But with innovation comes complexity, and with complexity, a need for systems that are not only high-performing but also reliably engineered for the long haul. Understanding the diversity and scale of the EV marketplace is essential to grasping the reliability challenges ahead.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.
SEL Showcases Global Factories and Product Development Journey for Manufacturing Day
10/10/2025 | SELSEL is celebrating Manufacturing Day 2025 with the release of a new video showcasing its product development and vertically integrated manufacturing process.