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YINCAE: UF 158UL Redefines Underfill for Large Chips

03/12/2025 | YINCAE
YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.

Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI

03/12/2025 | Ventec International Group
Ventec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.

Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025

03/05/2025 | Indium Corporation
Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.

IDENTCO to Showcase Specialized Labels and Presenters for Electronics Component Production at IPC APEX

02/26/2025 | IDENTCO
IDENTCO – a manufacturer of high-performance labeling solutions for the power equipment, electronics, transportation, and general industrial sector – will showcase its robust range of solutions for printed circuit boards (PCBs) and electronic components at IPC APEX Expo.

The Knowledge Base: Challenges and Considerations of Harsh Environments

02/26/2025 | Mike Konrad -- Column: The Knowledge Base
In today’s rapidly advancing technological landscape, electronic assemblies are increasingly being deployed into environments that push their design and material limits. From the corrosive atmospheres of industrial facilities to the extreme temperatures and humidity of outdoor applications, harsh environments present a significant challenge to the reliability of electronic devices. This column explores the key issues impacting electronics reliability in such conditions, including electrochemical migration (ECM), corrosion, and the role of residue tolerance in assembly design. 
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