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ZESTRON's Dr. Denis Barbini to Present at SMTA International
October 3, 2023 | ZESTRONEstimated reading time: Less than a minute

ZESTRON, a leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is excited to announce that Dr. Denis Barbini, Technical Solutions Manager at ZESTRON, will present "Utilizing SIR and Analytical Tools to Determine Impact to Reliability for Process Improvements" at the upcoming SMTA International Conference and Exhibition.
The presentation will delve into the challenges the electronics manufacturing industry faces when implementing new processes, machinery, or materials under Reision H of IPC-J-Std-001. Dr. Barbini, an industry expert with years of experience in the field, will explore how implementing advanced methodologies, such as Surface Insulation Resistance (SIR) testing and other analytical tools, can provide valuable insights into the reliability impact of process enhancements. Attendees will gain understandings into strategies for evaluating the efficacy of cleaning solutions, materials, and processes, ultimately ensuring that product reliability is not compromised.
For more information about ZESTRON's participation in SMTA International or to learn about their advanced cleaning solutions, visit ZESTRON at booth #1401 during the exhibition.
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KYZEN Cleaning Experts to Provide Insights at SMTA High Reliability Cleaning and Coating Conference
07/29/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announced today that three members of the KYZEN team of cleaning experts will present technical presentations as part of KYZEN’s participation at the 2025 SMTA High Reliability Cleaning and Conformal Coating Conference scheduled to take place Aug. 12-14, 2025 at the Westin DFW Airport.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
07/08/2025 | Mike Konrad -- Column: The Knowledge BaseIn electronics manufacturing, there’s a dangerous misconception that cleaning and coating are standalone options, that they operate in different lanes, and that one can compensate for the other. Let’s clear that up now. Cleaning and conformal coating are not separate decisions. They are two chapters in the same story—the story of reliability.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.