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Indium Corporation Introduces Au-Based Precision Die-Attach Preforms

07/17/2024 | Indium Corporation
Indium Corporation® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications.

SMTA Heartland Chapter Announces Rescheduled Date for High Reliability: Virtual STAR Forum

07/10/2024 | SMTA
The SMTA Heartland Chapter announces the rescheduled date for the High Reliability: Virtual STAR Forum, following the overwhelming success of our May event. Join us on Tuesday, July 30, 2024, for an afternoon of engaging discussions and expert insights into high-reliability manufacturing.

Letter of Urgency to the PCB Industry Gets Massive Response

07/09/2024 | EIPC
The EIPC have received overwhelming support for our Letter of Urgency calling for assistance to the European PCB industry.

The New Chapter: Artificial Intelligence in PCB Design

07/08/2024 | Hannah Grace & Paige Fiet -- Column: The New Chapter
With the rapid advancements in modern technology, a new era of PCB design is emerging, which includes the use of artificial intelligence (AI) and machine learning (ML). AI and ML have been all the rage in the news as they are becoming indispensable tools across various industries. Integrating AI and ML into the PCB design process not only elevates workflows and processes but also enhances the reliability and performance of products developed by the electronics industry.

IPC: Mitigating Hi-Rel Counterfeit Documentation Risks

07/03/2024 | IPC
Join Anthony J. Bryant as he previews his August IPC Counterfeit Electronic Parts Mitigation course on Jul 31, 2024 | 1:00 - 2:00pm EDT.
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