Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
AIM Solder’s Flopy Feng to Present on Pin in Paste Soldering at SMTA South China Conference
October 4, 2023 | AIM SolderEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA South China Technology Conference taking place on October 11-12, 2023, at the Shenzhen World Exhibition and Convention Center in Shenzhen, China. AIM Regional Technical Support Manager, Flopy Feng, will present on the topic: Pin in Paste.
Flopy Feng is a Technical Support Manager for AIM Solder. Having worked as a process supervisor for seven years, he is experienced in process evaluation and optimization. With over 20 years of experience in the SMT industry, Flopy supports AIM customers in South China. The abstract for his presentation is as follows:
Despite predictions of the demise of through-hole components, they remain commonplace throughout the industry. However, their use is in decline and assemblies may only incorporate one or two through-hole components. An alternative technique for soldering through-hole components, eliminating the need for a separate soldering process, is the Pin-in-Paste (PiP) or Intrusive Reflow method. PiP utilizes solder paste printing and the SMT reflow processes to solder through-hole devices. The PiP technique can be more cost effective by eliminating the need for a wave or selective soldering process and the associated costs. This presentation will detail the PiP process including PCB and stencil design considerations as well as solder paste selection and reflow guidelines.
Mr. Feng will deliver his presentation at the SMTA South China Technology Conference at 10:45 am on October 11.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.