AIM Solder’s Flopy Feng to Present on Pin in Paste Soldering at SMTA South China Conference

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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA South China Technology Conference taking place on October 11-12, 2023, at the Shenzhen World Exhibition and Convention Center in Shenzhen, China. AIM Regional Technical Support Manager, Flopy Feng, will present on the topic: Pin in Paste.

Flopy Feng is a Technical Support Manager for AIM Solder. Having worked as a process supervisor for seven years, he is experienced in process evaluation and optimization. With over 20 years of experience in the SMT industry, Flopy supports AIM customers in South China.​ The abstract for his presentation is as follows:

Despite predictions of the demise of through-hole components, they remain commonplace throughout the industry. However, their use is in decline and assemblies may only incorporate one or two through-hole components. An alternative technique for soldering through-hole components, eliminating the need for a separate soldering process, is the Pin-in-Paste (PiP) or Intrusive Reflow method. PiP utilizes solder paste printing and the SMT reflow processes to solder through-hole devices. The PiP technique can be more cost effective by eliminating the need for a wave or selective soldering process and the associated costs. This presentation will detail the PiP process including PCB and stencil design considerations as well as solder paste selection and reflow guidelines.

Mr. Feng will deliver his presentation at the SMTA South China Technology Conference at 10:45 am on October 11.