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The rapid advance of technology is driving changes in electronics that require increasingly smaller boards capable of handling higher signal speeds and supporting more robust software applications. Manufacturers are increasingly called upon to produce ultra high density interconnect (UHDI) PCBs, so it’s important to tune our production capabilities and customer service models to this trend. Non-conductive via fill (NCVF) offers a cost-effective, reliable manufacturing method that accommodates the densely packed, fine-pitch ball grid array (BGA) components present in UHDI designs.

Is U.S. EMS Growth Real or Just Repositioning?

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Based on survey data, U.S. EMS providers are reporting a noticeable uptick in orders, and the narrative forming around what’s driving that growth is familiar: tariffs, reshoring, and a long-awaited revival of domestic manufacturing. Some analysts even claim we’ve entered a super-cycle, a prolonged period of demand-driven economic growth that can last years to decades. But as is often the case in this industry, the reality is more nuanced.

Scanfil Advances Environmental Sustainability Through Climate Action and Resource Efficiency

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American Made Advocacy: Five Years of Educating, Advocating, and Influencing Legislation and Policy

05/26/2026 | Shane Whiteside -- Column: American Made Advocacy
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New Senate Bill Supports Reshoring and Restoring U.S. Printed Circuit Board Manufacturing

05/21/2026 | PCBAA
The Printed Circuit Board Association of America celebrates the introduction of a crucial bill that will pave the way to reshore and restore America’s printed circuit board (PCB) industry. Over the past 30 years U.S. share of the world supply of PCBs shrunk from 30 percent to 4 percent because of offshoring. Congress is offering legislative solutions to reverse this trend.
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