-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
IPC Day Netherlands: A Focus on U.S. and EU Aerospace Electronics
October 10, 2023 | Pete Starkey, I-Connect007Estimated reading time: 14 minutes
I was delighted to accept the invitation to attend the Oct. 4 IPC Day Netherlands: Aerospace Electronics, at ESTEC, the technical and scientific heart of the European Space Centre in Noordwijk.
It’s not the easiest place to get to from the UK, something I regretted. Because of Brexit, I am no longer an EU citizen and fully realized its implication when I saw the immigration tailback at Amsterdam’s Schiphol airport: a dozen auto-passport machines stood vacant while we foreigners queued for half-an-hour as three weary border-control policemen went through the formalities of checking and stamping our documents.
But at ESTEC I was made very welcome and greatly enjoyed the opportunity to learn about IPC’s activities in Europe as well as ESA’s advanced PCB technology. I heard expert presentations on training and standards, together with a privileged insight into the work and philosophy of NASA.
A full house of electronics industry professionals, managers, and engineers made the most of the occasion, met with their peers, exchanged their experiences, enhanced their technical knowledge and learned about the latest in industry standards and training opportunities.
The gathering was greeted by ESA materials engineer Stan Heltzel, whose department had kindly hosted the event, and the programme was introduced by IPC Europe managing director Philippe Léonard.
Léonard described the structure of IPC’s European operation and its function as “standards developer, and knowledge and education provider,” with more than 500 member companies, more than 500 volunteers on committees, and more than 30,000 certifications in Europe. He emphasised the activities of IPC in Brussels, where it is representing the electronics manufacturing industry and ensuring that the whole electronics manufacturing ecosystem is recognised by the European Commission, whose focus in relation to the European Chips Act had initially been only on silicon.
Léonard’s colleague—electronics technology standards manager Francisco Fourcade—described IPC standards as a fundamental part of the design and manufacturing process, with more than 300 in the library that are used worldwide for designing and manufacturing electrical and electronic products as well as for training, certification, and validation audit programmes. He stated clearly that the standards are industry-consensus documents, developed and maintained “by industry, for industry” by volunteers globally, using ANSI-accredited procedures. Any industry person can join a committee and participate at no cost.
Fourcade described the standards-development process, from initial working draft to final publication. He showed a simplified version of the IPC Standards Tree and explained how it provides guidelines for the production and assembly requirements of electronics manufacturing companies, with each code on the tree identifying a standard or document outlining the guidelines or requirements for building an assembly, from data transfer at the bottom of the tree to end-product at the top.
Training was the next topic for discussion. Master IPC Trainer Ramon Essers, CEO of ETECH Training, the leading IPC training centre for the electronics industry in Europe and authorised and licensed as an IPC Training Certification Centre, took to the floor, literally. He left behind the rostrum and the microphone and gave an animated interactive presentation while walking about. “Building better electronics starts with better training” was his maxim.
He quizzed the audience and asked them to rate each question on a scale of one to 10: “How good is your knowledge of the design of a PCB? What do you know about CIT? What do you know about PCB production? Do you know anything about it or is it brand-new for you? Do you know the difference between PCB and PCBA? He concluded his questions with, “What do you know about cleaning and conformal coating?” After we added up our scores, he determined that many of us had scores between 20 and 30 but few knew it all, and the one standard familiar to most was IPC-A-610, Acceptability of Electronic Assemblies. “Would this document solve all the problems?” he asked, then answered, “No!”
Essers also referred to the IPC Standards Tree and remarked that there are over 300 IPC standards, which would give a total of 4.2 times ten to exponential 19 of possible combinations of parameters. “How many bad solder joints are produced every year? Too many.” He enquired about what a perfect solder joint should look like, whether anyone has ever seen one, and listed a large selection of typical problems. The IPC-A-610 standard doesn’t tell the full story and it is necessary to start at the design and proceed through the Standards Tree from the bottom up, to figure out where to begin.
With some humorous examples of the serious subject of electronics reliability under space-travel conditions, he again asked, “Does IPC-A-610 solve all the problems?” as a preface to explaining IPC’s justification for offering training and certification through the whole chain, and describing how his organisation teaches how to design for manufacturing, visually inspect bare boards, do microsections, and visually inspect assemblies, and the significance of J-Standards for explaining which material, processes, and equipment to use to build reliable boards.
He explained the value of IPC certification to endorse the skills of individuals, and how IPC’s validation services provide qualified manufacturers lists (QMLs) and qualified products lists (QPLs). He remarked on the lack of validated companies in the Netherlands.
The highlight of the morning was the keynote presentation from Dr. Bhanu Sood, deputy chief technologist at NASA's Goddard Space Flight Centre in Greenbelt, Maryland, entitled “The Role of Standards in Shaping the Future of Aerospace Technology.”
Founded in 1959 as NASA's first space flight centre and currently one of nine NASA establishments, Goddard Space Flight Centre is home to the U.S.’s largest organisation of scientists, engineers, and technologists who build spacecraft, instruments, and new technology to study Earth, the sun, our solar system, and the universe.
Sood explained the structure of the Goddard establishment and its diverse mission portfolio, and listed the notable projects timetabled for the next five years. His responsibility at Goddard is the management of the technology development programme, identifying and evaluating new ideas and concepts for detectors and instruments for studying phenomena on earth and in space, aligned with NASA’s future direction.
Page 1 of 2
Suggested Items
Hunting for Clues: Feng Xue Solving Circuit Board 'Crimes' With AOI Standard
05/08/2025 | Linda Stepanich, IPCWhen residents in sleepy English villages needed a top-tier detective to solve a murder, they called on Belgian super-sleuth Hercule Poirot, author Agatha Christie’s fictional detective famous for using his “little grey cells” to solve crimes. In the same way, IPC standards development committees, when creating a standard to detect defects in circuit boards using Automated Optical Inspection (AOI), call on IPC A-Team, Hercule.
IPC Strengthens Global Focus with Promotion of Sanjay Huprikar to Chief Global Officer
05/08/2025 | IPCIPC, the global electronics association, announces the promotion of Sanjay Huprikar to chief global officer. This newly created position reflects the association’s forward-looking strategy and industry needs to strengthen the electronics supply chain.
Navigating Global Manufacturing in an Era of Uncertainty
05/07/2025 | Philip Stoten, ScoopThe EMS industry faces unprecedented challenges as global trade tensions rise and tariff announcements create market uncertainty. In an overview of IPC Europe’s podcast, MADE IN EUROPE, industry experts from GPV and Zollner examine how these developments impact our businesses and customers, and what strategies will prevail in this new landscape.
Nick Koop Launches IPC Flex Design Class
05/06/2025 | Andy Shaughnessy, Design007 MagazineNick Koop is director of flex technology for TTM Technologies, and he’s been a staple of IPC’s flex committees for decades. He’s also a longtime flex design instructor, and he’s about to debut a new IPC class, Flex and Rigid-Flex Design for Manufacturability, which will run May 12–21. In this interview, Nick tells us about this new class and what attendees can expect to learn.
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
05/06/2025 | Chris Mitchell -- Column: The Government CircuitThere is certainly no shortage of work to be done in the IPC Government Relations department, as the U.S. waged a tariff campaign on practically every industrial country in the world and several countries embarked on high-tech initiatives with a mix of approaches to the crucial foundations of electronics manufacturing. Indeed, the breadth and speed of U.S. President Donald Trump’s tariff campaign continues to be a serious challenge for our industry.