Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

UL Solutions Opens Advanced Automotive Electromagnetic Compatibility Laboratory in Japan

06/25/2026 | BUSINESS WIRE
UL Solutions Inc., a global leader in applied safety science, announced the opening of a new automotive electromagnetic compatibility laboratory in Toyota City, Japan, expanding its ability to support increasingly complex vehicle technologies in one of the world’s largest automotive markets.

Middle East Leads Global Infrastructure Shift as AI, Grid Modernization Accelerate, Siemens Finds

06/23/2026 | Siemens
A new study from Siemens reveals the Middle East is ready to enter a new era of infrastructure transition that is autonomous, resilient, and sustainable.

Target Condition: Signal Integrity Without Borders

06/24/2026 | Kelly Dack -- Column: Target Condition
I started my PCB design career in 1980, long before “signal integrity” became a formal discipline. Back then, we were trying to “connect the dots” on simple, two-sided PCB layouts using the new $80,000 interactive graphics terminals we called a CAD system. By the time PCB design conferences emerged in the 1990s, signal integrity had begun to formalize into a discipline of its own. Much of the early, visible thought leadership came from North America and parts of Europe.

Knocking Down the Bone Pile: The Business Case for Component Reclamation

06/23/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Electronic waste is increasing globally at an alarming rate. By 2030, it is estimated that the world will generate approximately 82 million tons of electronic waste per year. Rapid technological advances, shorter product lifecycles, and supply chain disruptions often lead manufacturers to build bloated inventories of electronic products. Unfortunately, some of this inventory ends up as electronic waste when components become obsolete or surplus to forecasted requirements, including high-value devices.

Smart Automation: When Traditional Depaneling Methods Reach Their Limits

06/16/2026 | Josh Casper -- Column: Smart Automation
PCB depaneling has traditionally been viewed as a relatively straightforward process in electronics manufacturing. Once the assembly process is complete, boards are separated from the panel and moved downstream for final assembly, test, or packaging. For years, manufacturers have relied on methods such as routing, V-score separation, and punch systems to handle this step efficiently and cost-effectively.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in