The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
ECD to Showcase New M.O.L.E. EV6 Features, Preview Expanding Touchscreen Thermal Profiling Portfolio at productronica 2023
October 17, 2023 | ECDEstimated reading time: 2 minutes
Since the launch of the first-ever touch control thermal profiler, M.O.L.E.™ EV6, ECD’s new tool has enjoyed wide industry uptake and has recently integrated additional features like Bluetooth® wireless connectivity. The company announced today that during productronica 2023 in Hall A4, Booth 246/3, visitors can experience M.O.L.E. EV6 first-hand, see a preview of soon-to-be-launched profilers, demo OvenSENTINEL™ reflow monitoring technology, and learn more about the scalable RIDER soldering equipment verification portfolio.
“Maximum productivity and expansive data are the keys to process efficiency and product quality,” says ECD Electronics Division Manager, Mark Waterman. “ECD’s objective from its founding has been to deliver on these elements through robust measurement, monitoring, and analysis technologies. As the market has evolved and data acquisition and presentation made more seamless, our product line has followed suit. The ability to view and act on information immediately through M.O.L.E. EV6’s touchscreen visibility and OvenSENTINEL’s real-time reflow monitoring are two examples that have demonstrated measurable improvements in yield, quality, and cost-efficiency. For ECD, this is a journey, and we continue to add features to existing technologies and bring new solutions to the industry. We’re excited to showcase many of these at productronica 2023.”
Expanding on M.O.L.E. EV6’s feature set, ECD has integrated Bluetooth wireless technology to enable remote data acquisition of real-time profile conditions through its M.A.P. software. This Bluetooth capability, ECD’s scalable WaveRIDER™, OvenRIDER™, and SelectiveRIDER™ sensor products, and the company’s OvenSENTINEL reflow soldering continuous monitoring software will be demonstrated throughout the four-day productronica event.
With the M.O.L.E. EV platform exceeding expectations, ECD has accelerated its planned rollout of additions to the EV-generation profiler portfolio. Currently in development, new high channel count tools will offer more flexibility for the demanding process needs of each customer and address market-specific requirements. Visitors to ECD’s productronica exhibit can see a preview of the new technologies, which are set to be commercialized in early 2024.
“Particularly for high-value, high-reliability PCBs destined for mission-critical applications like automotive, aerospace, alternative energy, and high-performance computing, expanded thermal profile data points are required to ensure compliant, fail-safe manufacturing,” says Waterman. “Our newest EV-series M.O.L.E.s will offer this capability, and we look forward to sharing them with the market soon!”
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.
Critical Minerals: The New Power Play in Global Trade
10/13/2025 | Marcy LaRont, I-Connect007Access to critical minerals essential for electronics manufacturing, and China’s monopoly of them, is increasingly under scrutiny, with gallium (Ga) and germanium (Ge)at the forefront of this discourse. However, all critical minerals imported from China share a similar narrative, and understanding the implications of this dependency and the risks to both U.S. commercial and defense sectors has created an urgent need for a comprehensive electronics strategy to secure and diversify access to these vital minerals. In this candid interview, USPAE Executive Director Jim Will discusses the issues and the mitigation steps that must be taken to adequately address them.
ICT Symposium Review: Sustainability and the Circular Economy
10/09/2025 | Pete Starkey, I-Connect007It was pleasant autumnal weather as we made our way once again to Meriden, the nominal centre of England, for the 2025 Annual Symposium of the Institute of Circuit Technology. Delegates were welcomed by technical director Emma Hudson who introduced and moderated a skilfully coordinated programme, focused on the highly relevant theme of sustainability.
Taiwan Rejects U.S. Proposal for 50-50 Semiconductor Production Split
10/03/2025 | I-Connect007 Editorial TeamTaiwan stated on October 1 that it will not agree to a U.S. proposal to shift half of its semiconductor production to the United States, despite mounting pressure from Washington over tariffs and chip supply security, according to Reuters.