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Qnity Expands AI-Driven Advanced Packaging with End-to-End Process Solutions

08/25/2026 | BUSINESS WIRE
Qnity Electronics, Inc. , a premier technology solutions leader across the semiconductor value chain, introduced a scalable materials solution platform that brings together metallization, bumping, dielectric, and fine-line patterning technologies to enable next-generation high-density and 3D integrated semiconductor systems.

NHanced Semiconductors & University of Florida to Present on Advanced Packaging for Photonics at the 2026 SMTAI Conference

08/24/2026 | NHanced Semiconductors
The upcoming SMTA International Conference will feature a paper titled “Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration,” presented by NHanced Semiconductors vice-president Dr. Charles Woychik and Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida.

NHanced Semiconductors, UF to Present Advanced Photonics Packaging at SMTAI 2026

08/18/2026 | PRNewswire
The upcoming SMTA International Conference will feature a paper titled “Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration,” presented by NHanced Semiconductors Vice President Dr. Charles Woychik and Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida.

More Than Moore Enabled by Advanced Packaging and Heterogeneous Integration

08/19/2026 | Chetan Arvind Patil, Marvell Technology
For more than a half-century, Moore's Law has been the defining principle of semiconductor innovation. By continually shrinking transistor dimensions, the semiconductor industry delivered exponential improvements in computing performance, energy efficiency, and integration density. Each new technology node enabled more transistors to be placed on a single die, reducing the cost per transistor and making electronic systems smaller, faster, and more capable. Though this scaling continues to advance, it is no longer the sole driver of system-level innovation, which now increasingly comes from a combination of scaling and advanced packaging.

Lam Research, NY CREATES Partner to Train Future Semiconductor Workforce

08/12/2026 | PRNewswire
Lam Research Corp. and New York Center for Research, Economic Advancement, Technology, Engineering and Science (NY Creates) announced a collaboration to enable the training of approximately 3,500 students in semiconductor process integration over the next five years.
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