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Cybord's Visual AI Solution to Be Integrated with Siemens' Opcenter MES

05/07/2025 | PRNewswire
Cybord, a leading provider of advanced visual-AI electronic component analytics, and Siemens Digital Industries Software have signed a new OEM agreement to integrate Cybord's cutting-edge AI technology with Siemens' Opcenter™ software for Manufacturing Execution Systems (MES).

SAIC Awarded New $55 Million Mission Integration Contract From Space Development Agency

05/05/2025 | SAIC
Science Applications International Corp. has been awarded the Proliferated Warfighter Space Architecture (PWSA) Tranche 3 Program Integration (T3PI) contract from the Space Development Agency (SDA).

SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit

05/05/2025 | SEMI
SEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.

SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics

05/01/2025 | SEMI
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.

Cicor Acquires Significant Business Activities of Éolane

04/21/2025 | Cicor
Cicor Group announces that its offer for the acquisition of significant business activities of the French Éolane Group has been accepted by the Paris Commercial Court. This strategic transaction marks a milestone in the execution of Cicor's pan-European growth strategy and further strengthens its market leadership in the aerospace and defence sector.
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