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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Don't Buy AI, Learn It: A Fabricator's Guide to Getting Started, Part 2

06/23/2026 | Sean Patterson, CrossGen AI
In Part 1, I covered common challenges encountered on a PCB shop floor, the missteps companies make when attempting to implement AI, and best practices to start that journey with a significantly higher likelihood of success. I identified six areas where AI’s strength in aggregating data can make the shop floor run more smoothly, create better process documentation across departments and between shifts, and even help capture tribal knowledge.

MicroLED Interconnect Market to Reach $722M by 2033

06/16/2026 | PRNewswire
The global MicroLED interconnect market is entering a period of accelerated growth as artificial intelligence (AI), high-performance computing (HPC), and next-generation data center architectures drive demand for faster, more energy-efficient communication technologies.

Follow the Story: The Chemistry Behind PCB Fabrication

06/16/2026 | I-Connect007 Editorial Team
Many of the decisions that shape reliability, yield, sustainability, and cost happen long before a board reaches final inspection. The choice of metallization process, surface finish, water treatment strategy, or etching approach can significantly impact manufacturing outcomes. Here are four articles worth revisiting that tackle different aspects of the same conversation: the chemistry and processes behind modern PCB manufacturing.

China’s Export Engine Keeps Accelerating Despite Global Turbulence

06/09/2026 | I-Connect007
China’s export sector continued to outperform expectations in May, with outbound shipments rising 19.4% year over year to US$376.8 billion, according to customs data released Tuesday. The result significantly exceeded economists’ forecasts and marked an acceleration from April’s already strong growth.

Innovative Flash Copper Plating Technology

05/21/2026 | Andreas Schatz and Mustafa Özkök, MKS’ Atotech
The continuous push toward higher functionality, miniaturization, and performance in modern electronic devices—such as smartphones, wearables, and advanced computing platforms—has intensified the demand for high-density interconnect (HDI) printed circuit boards. Central to HDI performance is the reliable formation of blind microvias (BMVs), which serve as critical interlayer connections in modified semi-additive processes (mSAP).
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