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Rogers Announces Addition of Woon Keat Moh to Board of Directors

12/23/2024 | Rogers Corporation
Rogers Corporation announced that Woon Keat Moh ("Moh") has been appointed as an independent member of the Company’s Board of Directors, effective January 1, 2025. Following this change, the Board will be composed of nine members, eight of whom are independent.

SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition

12/16/2024 | SCHMID Group
The SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.

Infineon Wins German Sustainability Award 2025

11/29/2024 | PRNewswire
Infineon Technologies AG -- has won the German Sustainability Award in the "Electrical Engineering and Electronics" category.

IDC Highlights Critical Emerging Role in Driving Customer-Centric Strategies Across Industries

11/13/2024 | IDC
International Data Corporation (IDC) announced new insights into the expanding role of the chief experience officer (CXO) as a driving force in shaping customer experience strategies across industries.

PCB007 Magazine October 2024: Alternate Metallization Processes

10/16/2024 | I-Connect007 Editorial Team
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop taking us into new directions. In this issue of PCB007 Magazine, we examine the impact of alternate metallization methods giving a glimpse into how and when we will arrive at 'destination metallization'.
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