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AIM to Highlight H10 at the SMTA Space Coast Expo & Tech Forum
October 17, 2023 | AIM SolderEstimated reading time: Less than a minute

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Space Coast Expo & Tech Forum taking place on November 1, 2023, at the Melbourne Auditorium in Melbourne, Florida. AIM will highlight their newest halogen-free no clean solder paste, H10.
H10 offers exceptional fine feature printing, improved electrochemical reliability, and powerful wetting in AIM's brand-new halogen-free no clean solder paste. H10 solder paste is capable of transfer efficiency >90% on area ratios of 0.50 and a stencil life >8 hours.
H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical reliability on all low stand-off devices. Fit for automotive, LED and aerospace assemblies, H10 no clean solder paste is robust, stable, and easy to implement.
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Federal Electronics Expands Selective Soldering Capabilities with Installation of Pillarhouse System
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Indium to Showcase Sustainable Solder Paste and Alloy Technologies at Detroit Battery Show
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Circuit Technology Center Expands Robotic Tinning Capacity with Two Additional Hentec/RPS Odyssey 1325 Machines
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SolderKing Marks Seven Years of Growth and International Recognition
10/01/2025 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, is celebrating seven years of innovation, growth, and international success.
Indium Features Next-Generation Materials for Semiconductor Assembly at IMAPS
09/29/2025 | Indium CorporationIndium Corporation, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.