-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
USPAE Announces Significant Response to DBX Microelectronics Challenge
October 18, 2023 | USPAEEstimated reading time: 1 minute
The U.S. Partnership for Assured Electronics (USPAE) announced that the Defense Business Accelerator (DBX) Microelectronics Challenge received twice the number of entries expected. Nearly two-thirds of the entrants are startups, and one-third are small- to medium-sized businesses. All are vying for a chance at awards between $500,000 and $2 million to advance commercially viable microelectronics solutions.
“We are very excited by the quantity and quality of the DBX entries for innovative electronic technologies and materials,” said Nathan Edwards, USPAE executive director. “This program helps advance solutions that will have commercial and defense applications while further strengthening the U.S. electronics industry.”
In a few weeks, finalists will be notified and invited to pitch their solutions at the Defense TechConnect Innovation Summit & Expo in late November.
“Defense TechConnect draws leaders from private industry, investment and government to accelerate state-of-the-art technology solutions,” said Matt Laudon, vice president of the TechConnect Division at ATI. “The DBX project is a great example of how new approaches can leverage innovation hubs to achieve great success.”
The innovative DBX program brings together the electronics industry expertise of USPAE with the U.S. Department of Defense’s (DoD’s) Manufacturing, Capability Expansion, and Investment Prioritization Directorate (MCEIP) to award funding through a process meant to accelerate the development of commercial solutions that the DoD can then leverage.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Molex to Acquire Teramount to Accelerate Scalable Co-Packaged Optics Adoption
04/15/2026 | PRNewswireMolex, a global electronics leader and connectivity innovator, announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fiber-to-chip connectivity solutions optimized for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications.
ASMPT Enhances WORKS Monitoring to Boost SMT Production Transparency and Accuracy
04/15/2026 | ASMPTASMPT SMT Solutions, the technology and market leader in integrated hardware and software solutions for electronics manufacturing, presents a new version of WORKS Monitoring.
Acron Technologies Acquires Alereon, Expanding Its Advanced Defense Capabilities
04/14/2026 | PRNewswireAcron Technologies, a portfolio company of TJC, L.P., announced the acquisition of Alereon, Inc., a fabless semiconductor company focused on ultra-wideband (UWB) solutions for the defense electronics market.
Solder Paste Innovations for Enhanced Reliability from MacDermid Alpha Electronics Solutions
04/10/2026 | Real Time with... APEX EXPOJason Fullerton of MacDermid Alpha Electronics Solutions discusses innovative alloys like Innolot MXE, low-temperature solder options, and polymer reinforcement strategies. Learn how these solutions address the growing demands of high-performance computing and larger component assemblies, ensuring optimal performance and cost-effectiveness.
Mycronic's AI Innovations for Manufacturing
04/03/2026 | Real Time with... APEX EXPOMycronic has made groundbreaking advancements in AI-driven manufacturing solutions. Kevin Clue, VP of Global Sales, details their investment in AI to simplify machine operation, programming, and data analysis. GenI Generative AOI Programming, a revolutionary feature enabling zero programming for AOI systems, empowers de-skilled operators and addresses workforce challenges. Mycronic's interconnected solutions enhance efficiency and customer value.