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Beyond Design: High-speed Rules of Thumb

11/21/2024 | Barry Olney -- Column: Beyond Design
The idiom “rule of thumb” is often used in electronics design and has its origins in the practice of measuring roughly with one’s thumb. Rules of thumb are easy-to-remember, broadly accurate guides or principles based on practice rather than theory. They are used to help feed our intuition to find a quick solution based on experience. We are often forced to use rules of thumb in PCB design in the absence of expensive analysis tools. We also use them to get quick ballpark figures initially and then fine-tune the numbers with further analysis. We can use rules of thumb as a sanity check to assess whether we are using our tools correctly. In this month’s column, I will present some commonly used and helpful rules for high-speed PCB design.

Danish-founded Defense Group Aims for More Responsibility Within Defense Supply Chain

09/09/2024 | CONFIDEE
Under the slogan "Together We Are Stronger," the AS9100 Nordic Consortium unites a powerful network of committed Danish companies, along with one Norwegian partner. This collaboration strives to elevate the defense and aerospace industries through a shared focus on traceability and quality management.

Beyond Design: Termination Planning

06/24/2024 | Barry Olney -- Column: Beyond Design
The characteristic impedance of a transmission refers to the impedance seen by a driver looking down an infinitely long trace. Interestingly, the characteristic impedance is independent of trace length. It’s a measure of the ratio of inductance to capacitance at any point along the trace. Therefore, while trace length matters for signal propagation delay, it doesn’t directly impact characteristic impedance. When a transmission line is perfectly matched to the driver and load, the signals propagating electromagnetic (EM) energy are totally absorbed by the load. This is the perfect scenario that all electronics designers strive for. However, this is rarely the case, and reflections do occur whenever the impedance of the transmission line changes along its length.

Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs

05/07/2024 | Happy Holden -- Column: Happy’s Tech Talk
A significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.

Quiet Power: The Effect on SI and PI Board Performance

01/18/2024 | Istvan Novak -- Column: Quiet Power
In signal and power integrity (SI and PI), we would ultimately like to see a reasonable agreement between the predicted or simulated and the measured performance of our circuits. Real-world measurements will always contain errors and usually show a distorted replica of the true behavior of the device under test (DUT). Real measurements always show more than just the behavior of the DUT. Even if we don’t consider random noise and random errors, in the measured data we have contributions from instrument, cable, and probe errors (just to name a few) that our calibration could not completely remove.
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