-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC Releases IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards
October 19, 2023 | IPCEstimated reading time: 1 minute
IPC has released IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards. This document is the base standard for addendums covering military and space requirements, medical requirements, and automotive requirements.
IPC-6012 provides requirements for the qualification and performance of rigid printed boards based on constructions and /or technologies such as; single-sided, double-sided printed boards with and without plated-through holes (PTH), multilayer printed boards with PTHs with or without buried/blind vias/microvias, active/passive embedded circuitry printed boards with distributive capacitive planes and/or capacitive or resistive components and metal core printed boards with or without an external metal heat frame, which may be active or non-active.
Among the many additions to IPC-6012F, are expanded requirements in the following areas: printed board cavities, copper wrap plating, “Intermediate” target lands, solderability testing, dewetting, microsection evaluation, internal plated layers, dielelctric spacing and reliability issues with microvia structures.
“The hard work put in by the IPC D-33a Rigid Printed Board Performance Specifications Task Group over the past three years has resulted in a substantial revision to IPC-6012,” said John Perry, IPC’s director of printed board standards and technologies. Perry also stated, “IPC-6012F incorporates test coupon designs well suited to evaluate complex, interconnected via structures as part of an overall effort to address microvia reliability. Add to that new criterion for printed board cavities, hole registration, internal plated layers and dielectric spacings and you have a performance specification that addresses advances in rigid printed board fabrication processes.”
Suggested Items
Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI
05/29/2025 | Amphenol Printed CircuitsAmphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.
Global PCB Market Forecast to Reach $86.5 Billion by 2029 with 5.9% Annual Growth
05/19/2025 | EINPresswire.comThe printed circuit board market size has witnessed steady growth in recent years and the trend is anticipated to continue. Increasing from $65.82 billion in 2024 to $68.75 billion in 2025, it showcases a compound annual growth rate CAGR of 4.5%.
Roca Printed Circuits Joins Forces with Epec Engineered Technologies, NetVia
05/14/2025 | Epec Engineering TechnologiesRoca Printed Circuits and Epec Engineered Technologies announced today that Roca has joined forces with Epec’s NetVia Group PCB division in Dallas, expanding the combined organization's ability to deliver a broader range of high-quality printed circuit boards and electronic solutions.
American Standard Circuits to Exhibit and Speak at SMTA Oregon Expo
05/14/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will be exhibiting SMTA Oregon Expo & Tech Forum to be held on May 20 at the Wingspan Events and Conference Center in Hillsboro, Oregon.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.