-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdditive Manufacturing
In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
The Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards
October 20, 2023 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
Cadence Design Systems, Inc. announced that it has won four Open Innovation Platform® (OIP) Partner of the Year awards from TSMC for its EDA and IP design solutions. Cadence was presented with awards for the joint development of the N2 and N3P design infrastructure, 3Dbloxdesign prototyping solution, mmWave design solutions and DSP IP. The awards build upon the companies’ long-standing history of collaboration that has delivered many highly innovative SoC and advanced packaging design solutions to the global market.
The awards are based on the following TSMC collaborations:
- N2 and N3P Design Infrastructure: Cadence optimized its complete digital and custom/analog flows for the TSMC N2 and N3E process technologies to help customers achieve power, performance and area (PPA) goals and accelerate innovation. Additionally, Cadence’s AI-powered solutions, Cadence® Cerebrus™ Intelligent Chip Explorer and Virtuoso® Studio, support these nodes, offering customers innovative automation capabilities to make them more efficient.
- Joint Development of 3Dblox Design Prototyping Solution: Design flows based on the Cadence Integrity™ 3D-IC Platform support the TSMC 3Dblox standard for 3D front-end design partitioning in complex systems. The flows include system prototyping flows, which are optimized for all of TSMC’s latest 3DFabric™ offerings, including Integrated Fan-Out (InFO), Chip-on-Wafer-on-Substrate (CoWoS®) and System-on-Integrated-Chips (TSMC-SoIC® ) technologies.
- Joint Development of mmWave Design Solutions: The new Cadence Virtuoso Studio was integrated into the TSMC N16 mmWave RF design reference flow and N6RF design reference flow, and support has been added for the N4P RF design reference flow. In addition, Cadence collaborated with TSMC to optimize the Virtuoso platform for the 79GHz mmWave design reference flow on TSMC’s N16 process.
- DSP IP: Cadence expanded its collaboration with TSMC’s Soft IP9000 team to certify Cadence Tensilica® DSP IP in the TSMC integration flow.
“TSMC works continuously with our OIP design partners to enable technology advancements that make it faster and easier for customers to deliver competitive designs to market, simpler for customers to adopt our solutions,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “Cadence’s commitment to design excellence is exemplary, and the TSMC OIP Partner of the Year awards are a testament to their dedication to ongoing innovation.”
“By continuing to collaborate closely with TSMC, we’re constantly energized by the innovations our customers bring to life using our technologies,” said Dr. Chin-Chi Teng, senior vice president and general manager of the Digital & Signoff Group at Cadence. “It’s an honor to be recognized with these prestigious TSMC awards, and they are a testament to the work we’ve done to enable our customers to achieve their design and time-to-market goals.”
Suggested Items
Bell Awarded Funding for Phase 1B of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
05/30/2024 | BellBell Textron Inc., a Textron Inc. company, has been down-selected for Phase 1B of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program.
Cambridge GaN Devices Signs MoU with ITRI Covering GaN-based Power Supply Development
05/30/2024 | BUSINESS WIRECambridge GaN Devices (CGD), the fabless, clean-tech semiconductor company, dedicating to develop energy-efficient GaN-based power devices that make greener electronics possible, has signed a Memorandum of Understanding with Industrial Technology Research Institute (ITRI) of Taiwan to solidify a partnership in developing high performance GaN solutions for USB-PD adaptors.
Connect the Dots: Designing for Reality—The Physical Manufacturing Phases
05/30/2024 | Matt Stevenson -- Column: Connect the DotsDesigning for reality is focused on the art and science of PCB design and production. If you’re trying to make a PCB that stands out for being reliable, easy to manufacture, and meets all design goals, then you’re in the perfect spot. We’re here to break down the PCB manufacturing process while sharing essential tips for smooth design and production.
Elementary, Mr. Watson: Pushing Design Boundaries
05/29/2024 | John Watson -- Column: Elementary, Mr. WatsonOverconstraint: What a concept. Our first thoughts would be: What are we hurting by overconstraining a design? Isn't it better to be safe than sorry? What is meant by overconstraint? It means to apply excessive constraints. In engineering and mathematics, it's used when there are too many simultaneous equations to result in an exact solution. For example, fitting a line to many points is overconstrained because a line cannot be drawn simultaneously through all of the points. In PCB design, overconstraints always occur, including dimensional, electrical, manufacturing, and timing constraints. The list goes on.
Marvell Grows Presence in Vietnam at Accelerated Rate
05/29/2024 | Marvell Technology, Inc.Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, has accelerated the growth of its workforce and presence in Vietnam in the past year since the company announced plans to expand R&D, engineering and design activities in the country.