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Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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Upcoming Webinar to Explore Next Generation Applications Like High-speed Networking and Telecom
October 23, 2023 | Saturn Electronics CorporationEstimated reading time: Less than a minute
Saturn Electronics Corp. recently announced plans to host a Thermal Management PCB webinar.
The webinar will go beyond basic LED technology and delve into advanced methods of thermal management that are also applicable in other industries such as high-speed networking and telecom.
Detailing alternative methods that provide cost savings with limited performance loss will further the viewer’s knowledge base.
The webinar will also explore technologies currently under development for future thermal management solutions.
Save the date and join us for this discussion at 11:00 a.m. Eastern, Thursday, November 16, 2023. Register now.
Suggested Items
Indium Promotes O’Leary to Director of Global Accounts
05/27/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to electronics, semiconductor, thin-film, and thermal management industries, announces the promotion of Brian O’Leary to Director of Global Accounts.
Robert C. Donovan Joins DISTRON, Marking the Third Generation in Family Leadership
05/26/2025 | Distron Corp.DISTRON CORPORATION, a leading U.S.-based electronics contract manufacturer, proudly announces that Robert C. Donovan, son of CEO Robert H. Donovan and grandson of Founder Robert G. Donovan, has joined the company as a Management Trainee. This milestone marks the beginning of the third generation of family leadership at the company.
Siemens to Bring Advanced Timing Constraint Capabilities to EDA Design Flow with Excellicon Acquisition
05/19/2025 | SiemensSiemens has entered into an agreement to acquire Excellicon to bring its best-in-class software for the development, verification, and management of timing constraints to Siemens’ EDA portfolio of software for IC design
New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions
05/14/2025 | I-Connect007In this episode we continue the conversation with NCAB Field Application Engineer Ryan Miller as we dive into practical design and manufacturing techniques for controlling thermal effects. Topics include via farms, insulated metal substrates, coin technology, and copper pedestals—solutions that help meet today's high-performance demands.
Laird Thermal Systems Unveils New Identity
05/05/2025 | Laird Thermal SystemsLaird Thermal Systems, a global leader in active thermal management solutions with more than 60 years of application expertise, today announced its rebrand to Tark Thermal Solutions.