Alex Stepinski on High-reliability Fabrication
October 23, 2023 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Alex Stepinski, principal and president of Stepinski Inc., and principal of Smart Process Design, has designed leading-edge PCB facilities and introduced a variety of novel systems and technologies into PCB manufacturing. We asked Alex to share his thoughts on high-reliability fabrication techniques, where manufacturers go wrong, and what fabricators need to do to step up their reliability game.
Barry Matties: Where does high reliability intersect with bare board fabrication and what should readers be thinking about?
Alex Stepinski: It’s about service life. That's what the clients want. They want high reliability so it doesn't fail in the field, and when it does, it's very far away in time. You must do accelerated testing to confirm that your product will be reliable for “X amount” of time, and that it also de-risked from white rhino/black swan events and T0/latent fails.
I would break down high reliability management into two influential categories: process design and product design. During the product design, what do they control? Fabricators control KPIs to get high reliability. They should have a model, or a set of rules based upon prior history, as to what works and what doesn't work. They should also have these rules correlated to qualification methods, because one OEM might use IST, another uses a different type with different conditions, and so on.
Reliability is a subset of the test conditions, and the higher the reliability, the higher the potential product value/willingness to pay, so fabs must make sure that they correlate their testing results to their product design attributes. But that precise regression is missing in a lot of cases, and there's a lot of diversity of test/qual methods. The big question is: What are the defects and/or parametric conditions that lead to reliability failure and can they be normalized? Today, many people are talking about HDI failures. Stacking microvias has been a common topic lately.
To read this entire conversation, which appeared in the October 2023 issue of PCB007 Magazine, click here.
Suggested Items
HyRel Announces Sale of First Versacell Robotic System to Leading Defense Contractor
12/03/2024 | HyRelHyRel Technologies, a global provider of quick-turn semiconductor modification solutions, is proud to announce the sale of its first Versacell Robotic Solder Dip & BGA Reballing System to one of the top five defense contractors. Originally developed for internal use, the revolutionary Versacell System drew the attention of the contractor, who recognized its impressive precision, accuracy, and efficiency.
GEN3 Announces Exclusive UK Distribution Partnership with RAS for HATS2 Test System
11/19/2024 | Gen3GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, is pleased to announce its partnership with Reliability Assessment Solutions Inc. (RAS), a leader in advanced reliability testing solutions.
DuPont to Feature Innovative Electronics Products and Solutions at Electronica 2024
11/13/2024 | DuPontAs the demand for advanced technology surges, DuPont will be featuring its extensive portfolio of innovative products and solutions at Electronica 2024, the world’s premier trade fair for electronics, November 12-15 in Munich.
Absolute EMS Earns ITAR Registration
10/31/2024 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), proudly announces its ITAR (International Traffic in Arms Regulations) registration, reinforcing its commitment to serving military, aerospace and defense OEM customers.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.