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Suggested Items

Looking Into Space: EIPC Summer Conference, Part Two

06/17/2024 | Pete Starkey, I-Connect007
“Innovative Development of PCB Technology and Design” was the theme of the second session of the 2024 EIPC Summer Conference, June 4-5, at the European Space Centre, Noordwijk, The Netherlands.

SEMI FlexTech Invites Proposals for Flexible Hybrid Electronics Innovations With Cash Awards of Up to $1 Million

06/17/2024 | SEMI
FlexTech, a SEMI Technology Community, issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $1 million.

Rogers Announces Further Actions to Streamline Operations and Drive Margin Improvement

06/07/2024 | Rogers Corporation
Rogers Corporation announced plans to drive further operational efficiency and margin improvement. Rogers intends to wind down manufacturing of advanced circuit materials and other related activities at its Evergem, Belgium factory by mid-2025.

The Pulse: Overconstraining: Short, Slim, and Smooth

06/06/2024 | Martyn Gaudion -- Column: The Pulse
Engineering is both an art and a science. The design engineer’s task is (almost) always to bring product to market that meets specifications at the best and most economical price suited to the appropriate end use requirements. From a PCB perspective, designers are faced with a bewildering and almost overwhelming choice of materials at their disposal.

Overconstrain? Underconstrain? Selecting Materials for High-speed Designs

06/06/2024 | Andy Shaughnessy, Design007 Magazine
When selecting materials for a high-speed design, you need to be very familiar with the materials’ electrical characteristics, as well as the requirements of the PCB you’re designing. There are myriad details that need to be considered during the material selection process, and missing one iota can lead to your job being put on hold. We asked Stephen Chavez, principal technical product marketing manager at Siemens, to share his thoughts on material selection for high-speed designs. Steph discusses material constraints, stackups, and the cut-off point when a “traditional” laminate will (and won’t) work for a high-speed board.
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